Direct-electroplating conductive liquid and preparation method thereof

A kind of conductive liquid, direct technology, applied in the field of conductive liquid, can solve the problems of weak conductivity, poor adsorption force, low electroplating efficiency, etc., to achieve the effect of small particle size, inhibition of agglomeration, and high electroplating efficiency

Inactive Publication Date: 2013-05-15
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to overcome the shortcomings of poor adsorption, weak conductivity and low electroplating efficiency i

Method used

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  • Direct-electroplating conductive liquid and preparation method thereof
  • Direct-electroplating conductive liquid and preparation method thereof
  • Direct-electroplating conductive liquid and preparation method thereof

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Embodiment 1

[0030] This embodiment is a direct electroplating conductive solution. The conductive liquid is composed of 0.5g / L graphene and 0.2g / L polyacrylic acid stabilizer, and is prepared by using ammonia water as a pH regulator and deionized water.

[0031] The thickness of the graphene ≤ 1.0nm, particle size ≤ 200nm

[0032] The process of preparing said direct electroplating conductive solution is:

[0033] Step 1, prepare graphene dispersion liquid. Heat 500 mL of deionized water to 60 °C. 0.5 g / L graphene was added into the deionized water, and dispersed by ultrasonic waves for 1 h to obtain a graphene dispersion.

[0034] Step 2, preparing a stabilizer solution. Another 200 mL of deionized water was taken, and 0.2 g / L powdered polyacrylic acid stabilizer was added into the 200 mL of deionized water to dissolve to obtain a stabilizer solution.

[0035] Step 3, add the stabilizer solution. The obtained polyacrylic acid stabilizer solution was added to the graphene-added deio...

Embodiment 2

[0042] This embodiment is a direct electroplating conductive solution. The conductive liquid is composed of 1.0g / L graphene, 0.4g / L polyacrylic acid stabilizer, ammonia water as a pH regulator, and deionized water.

[0043] The thickness of the graphene ≤ 1.0nm, particle size ≤ 200nm

[0044] The process of preparing said direct electroplating conductive solution is:

[0045] Step 1, prepare graphene dispersion liquid. Heat 500 mL of deionized water to 70 °C. 1.0 g / L graphene was added into the deionized water, and dispersed by ultrasonic wave for 2 h to obtain a graphene dispersion.

[0046] Step 2, preparing a stabilizer solution. Another 200 mL of deionized water was taken, and 0.4 g / L powdered polyacrylic acid stabilizer was added into the 200 mL of deionized water to dissolve to obtain a stabilizer solution.

[0047] Step 3, add the stabilizer solution. The obtained polyacrylic acid stabilizer solution was added to the graphene-added deionized water in the dispersio...

Embodiment 3

[0054] This embodiment is a direct electroplating conductive solution. The conductive liquid is composed of 2.0g / L graphene, 0.6g / L polyacrylic acid stabilizer, ammonia water as a pH regulator, and deionized water.

[0055] The thickness of the graphene ≤ 1.0nm, particle size ≤ 200nm

[0056] The process of preparing said direct electroplating conductive solution is:

[0057] Step 1, prepare graphene dispersion liquid. Heat 500 mL of deionized water to 80 °C. 2.0 g / L graphene was added into the deionized water, and dispersed by ultrasonic wave for 3 h to obtain a graphene dispersion.

[0058] Step 2, preparing a stabilizer solution. Another 200 mL of deionized water was taken, and 0.6 g / L powdered polyacrylic acid stabilizer was added into the 200 mL of deionized water to dissolve to obtain a stabilizer solution.

[0059] Step 3, add the stabilizer solution. The obtained polyacrylic acid stabilizer solution was added to the graphene-added deionized water in the dispersio...

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Abstract

The invention discloses a direct-electroplating conductive liquid and a preparation method thereof. The method comprises the following steps of adding graphene of 0.5-2.0g/L and a stabilizer of 0.2-0.6g/L into the deionized water of 500mL, dispersing by ultrasonic with frequency of 45KHz and power of 100W at 60-80 DEG C for 1-3 hours, then adding 200mL of 1-3% of an organic or inorganic stabilizer, regulating the pH value to 9-11 with a pH value modifier of 10%, replenishing the deionized water to 1000mL, dispersing by the ultrasonic continuously for 1 hour, and obtaining 1L of the direct-electroplating conductive liquid. The stabilizer comprises one or more agents among polyacrylic acid, carboxymethylcellulose, and sodium silicate. Being used for hole metallization, the conductive liquid provided by the invention has the advantages that the grain size is small, the use level is small, the adsorption capacity is strong, the formed grain layer is compact, the conductivity is strong, and the electroplating efficiency is high; furthermore, the conductive liquid is convenient and simple to use and maintain, and environment contamination is avoided.

Description

technical field [0001] The invention belongs to the technical field of the electronic industry and relates to a conductive liquid capable of directly electroplating a printed circuit board (PCB). The present invention further relates to a conductive solution capable of directly electroplating non-conductors. Background technique [0002] With the rapid development of electronic industry technology, the demand for PCB is increasing day by day. On the printed circuit substrate, in order to connect the circuits to each other, it is necessary to drill through holes on the substrate, and to plate conductive metal on the inner wall of the hole, that is, hole metallization. Hole metallization is one of the key processes in the PCB manufacturing process. At present, the colloidal palladium activation solution is mainly used as a catalyst for electroless copper plating on PCBs; one or two particles of graphite and carbon black are used as conductive particles for direct copper plati...

Claims

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Application Information

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IPC IPC(8): C25D5/54
Inventor 薛擎天
Owner NORTHWESTERN POLYTECHNICAL UNIV
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