Micro-strip interdigital circuit board for microwave non-thermal effect research
A thermal effect, circuit board technology, applied at the intersection of microwave technology and chemical technology
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[0028] The overall structure of the microstrip interdigitated circuit board is as follows: Figure 1-3 As shown, the microstrip interdigitated circuit board is printed on a printed circuit board. The printed circuit board consists of a microstrip interdigitated circuit layer I composed of left and right feed sections 3, 3', left and right impedance transformation branches 2, 2', left and right interdigitated units 1, 1', and a dielectric layer made of polytetrafluoroethylene. The dielectric layer II of the printed circuit board is made of polytetrafluoroethylene material with a relative permittivity of 2.65 and a thickness of 2mm.
[0029] Such as image 3 As shown, the structural parameters of the microstrip interdigitated circuit layer I are obtained through numerical simulation optimization, and the dimensions of each part are:
[0030] The length of the left and right feeding sections 3 and 3' is a=15mm, the width is b=5.5mm, the characteristic impedance is 50 ohms, the l...
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