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Single component room temperature curing epoxy construction glue

A technology of room temperature curing and construction glue, which is applied in the direction of epoxy resin glue, adhesives, non-polymer adhesive additives, etc. It can solve the problems of only being discarded, polluting building materials, and glue that cannot be recycled, and achieves convenient construction and use , the effect of a wide range of raw material sources

Inactive Publication Date: 2013-06-05
常熟市辛庄镇前进五金厂
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of this two-component epoxy construction adhesive are: firstly, the construction personnel need to strictly follow the proportion of A and B components and mix evenly before construction. If the proportion of A and B components is incorrect and / or the mixing is not If it is uniform, it will cause a decrease in bonding strength, and even pollute building materials and other adverse effects; secondly, the remaining glue after construction cannot be recycled and can only be discarded (because components A and B have been blended), resulting in serious waste.

Method used

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  • Single component room temperature curing epoxy construction glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] 80 parts of bisphenol A type epoxy resin;

[0023] 6 parts of ethylene glycol diglycidyl ether;

[0024] 12 parts of diethylenetriamine;

[0025] 3 parts of γ-aminopropyltriethoxysilane;

[0026] 0.5 parts of three-(dimethylaminomethyl)phenol;

[0027] Silicon dioxide 1.2 parts.

[0028] Wherein: the epoxy value of bisphenol A type epoxy resin is 0.52 equivalent / 100g.

Embodiment 2

[0030] Bisphenol F type epoxy resin (epoxy value 0.48 equivalent / 100g) 85 parts;

[0031] 12 parts of 1,4-butanediol diglycidyl ether;

[0032] 14 parts of triethylenetetramine;

[0033] 3.6 parts of γ-aminopropyltriethoxysilane;

[0034] 0.7 parts of three-(dimethylaminomethyl)phenol;

[0035] Precipitated silica 3.0 parts.

Embodiment 3

[0037] 90 parts of polyglycidyl ether epoxy resin (epoxy value 0.46 equivalent / 100g);

[0038] 15 parts of tetraethyl orthosilicate;

[0039] 10 parts of diethylenetriamine;

[0040] 5 parts of hexahydropyridine;

[0041] 4.2 parts of γ-aminopropyltriethoxysilane;

[0042] 1.2 parts of three-(dimethylaminomethyl)phenol;

[0043] 2.0 parts of fumed silica;

[0044] Nano magnesium oxide 2.0 parts.

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Abstract

The invention provides single component room temperature curing epoxy construction glue and belongs to the technical field of construction adhesive. The single component room temperature curing epoxy construction glue is formed by the following materials, by weight, 80-100 parts of epoxy resin, 5-25 parts of diluent, 10-20 parts of curing agent, 3.0-5.0 parts of coupling agent, 0.5-2.0 parts of accelerant, and 1.0-8.0 parts of filler. Compared with two-component epoxy adhesive in the prior art, the single component room temperature curing epoxy construction glue has the advantages that raw materials are wide in source and low in price; convenience is achieved in the process of construction and use, the phenomenon of waste like the two-component epoxy adhesive can not happen; and the single component room temperature curing epoxy construction glue can be cured at room temperature, and bonding requirements for stones, wood, concrete, metal, ceramics, glass and the like can be met.

Description

technical field [0001] The invention belongs to the technical field of construction adhesives, and in particular relates to a single-component room temperature curing epoxy construction adhesive. Background technique [0002] With the rapid development of my country's construction industry, new building materials are also constantly being developed. In order to meet the bonding requirements of most building materials such as stone, wood, concrete, metal, ceramics and glass, adhesives with epoxy resin as the main body are widely used. in the field of construction. [0003] At present, most of the epoxy adhesives commonly used in the construction industry are two-component, that is, component A is composed of epoxy resin and filler, while component B is composed of epoxy curing agent and filler, and it needs to be prepared and used immediately. Such as Chinese invention patent application publication number CN101602926, CN102146266A and CN101712857A are all two-component epoxy...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J11/04C09J11/06
Inventor 黄多能
Owner 常熟市辛庄镇前进五金厂
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