Single component room temperature curing epoxy construction glue
A technology of room temperature curing and construction glue, which is applied in the direction of epoxy resin glue, adhesives, non-polymer adhesive additives, etc. It can solve the problems of only being discarded, polluting building materials, and glue that cannot be recycled, and achieves convenient construction and use , the effect of a wide range of raw material sources
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[0021] Example 1:
[0022] 80 parts of bisphenol A epoxy resin;
[0023] 6 parts of ethylene glycol diglycidyl ether;
[0024] 12 parts of diethylenetriamine;
[0025] 3 parts of γ-aminopropyltriethoxysilane;
[0026] 0.5 parts of tris-(dimethylaminomethyl)phenol;
[0027] 1.2 parts of silica.
[0028] Among them: the epoxy value of the bisphenol A epoxy resin is 0.52 equivalent / 100g.
Example Embodiment
[0029] Example 2:
[0030] Bisphenol F epoxy resin (epoxy value 0.48 equivalent / 100g) 85 parts;
[0031] 12 parts of 1,4-butanediol diglycidyl ether;
[0032] 14 parts of triethylenetetramine;
[0033] 3.6 parts of γ-aminopropyltriethoxysilane;
[0034] 0.7 parts of tris-(dimethylaminomethyl)phenol;
[0035] 3.0 parts of precipitated silica.
Example Embodiment
[0036] Example 3:
[0037] 90 parts of polyglycidyl ether epoxy resin (epoxy value 0.46 equivalent / 100g);
[0038] 15 parts of ethyl orthosilicate;
[0039] 10 parts of diethylenetriamine;
[0040] 5 parts of hexahydropyridine;
[0041] 4.2 parts of γ-aminopropyltriethoxysilane;
[0042] 1.2 parts of tris-(dimethylaminomethyl)phenol;
[0043] Fumed silica 2.0 parts;
[0044] 2.0 parts of nano-magnesium oxide.
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