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Phosphor powder prefabricated film encapsulation method for white LED film encapsulation

A thin-film encapsulation and encapsulation method technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of incomplete light chromaticity and long time consumption of devices, and achieve easy control of phosphor content, simple preparation process, and reduced The effect of the cofferdam process

Active Publication Date: 2016-08-03
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The traditional white LED adopts dispensing process, which takes a long time, and due to the sedimentation of phosphor powder, the light chromaticity of devices manufactured in different batches or even the same batch is not completely the same; for the same device, due to the Phosphor powder is thick in the middle and thin around, resulting in yellowish in the middle and bluish in the surrounding

Method used

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  • Phosphor powder prefabricated film encapsulation method for white LED film encapsulation
  • Phosphor powder prefabricated film encapsulation method for white LED film encapsulation
  • Phosphor powder prefabricated film encapsulation method for white LED film encapsulation

Examples

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Effect test

Embodiment 1

[0023] Example 1. Measure 5g of fluorescent powder, 5g of A and B silica gels, mix them evenly, and carry out vacuum defoaming, and apply them on the mold by screen printing method to obtain a film with a thickness of 0.5mm. Cure for 30 minutes. Position the prefabricated film on the flat LED with the gold wire, press it, and cure it at 140 degrees for 2 hours. The implementation effect is as follows figure 1 shown.

Embodiment 2

[0024] Example 2. Measure 5g of fluorescent powder, 5g of A and B silica gels, mix them evenly, and carry out vacuum degassing, apply them on the mold by screen printing method, support a film with a thickness of 0.5mm, and cure at 140 degrees 30 minutes. Position the prefabricated film on the vertical LED with the gold wire, press it, and cure it at 140 degrees for 2 hours. The implementation effect is as follows figure 2 shown.

Embodiment 3

[0025] Example 3. Measure 5g of fluorescent powder, 5g of A and B silica gels, mix them evenly, and carry out vacuum defoaming, and apply them on the mold by screen printing method to make a film with a thickness of 0.5mm. Cure for 30 minutes. Position the prefabricated film on the vertical LED with the gold wire, press it, and cure it at 160 degrees for 1 hour. The implementation effect is as follows figure 2 shown.

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Abstract

The invention relates to a fluorescent powder prefabricated film for white light LED film packaging and a preparation method thereof. The composition of the film is fluorescent powder and adhesive, and the adhesive is silica gel or epoxy resin. It is coated on the mold by screen printing method to form a layer of film, and then cured at 50-200oC for 5-100 minutes to obtain a film that is not completely cured but has a certain rigidity. The film realizes the packaging of white LED devices and modules through positioning, pressing, and secondary curing. This method can solve the problem of light consistency between the same batch and different batches; avoid the use of cofferdam materials, reduce the cofferdam process, and reduce costs; because the prefabricated fluorescent film is a semi-cured film, it has certain plasticity, Effectively avoids the damage of the prefabricated film to the bonding gold wire; and as the last packaging process of flip-chip, vertical structure and planar structure white LEDs, it has a wide range of applications; due to the use of thin film packaging, the 3D of devices and modules is reduced. size, which can greatly increase the density of integrated packaging.

Description

technical field [0001] The invention relates to a fluorescent powder prefabricated film for white light LED film packaging, a preparation method thereof and a preparation method thereof. Background technique [0002] As a new type of high-efficiency solid light source, semiconductor lighting has significant advantages such as long life, energy saving, and environmental protection. It is another leap in the history of human lighting after incandescent lamps and fluorescent lamps. It means a lot. [0003] The existing white light LED lighting technology based on LED chips is simple and easy to use with blue LEDs or ultraviolet chips combined with yellow phosphor (PCLED-phosphor converted light emitting diode), and the research and development are the most extensive, especially with the blue LED chips in recent years. With the rapid improvement of efficiency, the application process of this PCLED solid-state lighting technology has been significantly accelerated, and it has re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50
CPCH01L2224/16245H01L2224/48091H01L2224/48247
Inventor 杨连乔王浪陈伟张建华
Owner SHANGHAI UNIV
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