LED packaging glue and preparation method thereof

A technology of LED packaging and base glue, applied in the direction of adhesives, etc., can solve the problems of less than 90% light transmittance, poor high and low temperature resistance, poor yellowing resistance, etc., and achieve good water resistance, good bending performance, and good UV resistance Effect

Inactive Publication Date: 2013-07-03
SHENZHEN JINLIAN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the LED flexible light strip glue on the market basically adopts epoxy resin encapsulant, PU polyurethane encapsulant, condensed (10:1) or (4:1) silica gel, but these encapsulants have poor yellowing resistance and high resistance. Poor low temperature resistance or poor tear strength and other shortcomings, this type of encapsulant has high transparency, good flexibility, good weather resistance, non-yellowing characteristics and excellent high and low temperature resistance
In addition, a single-component silica gel from Japan Shin-Etsu used in the market has good adhesion and flexibility, but due to the addition of white carbon black and other powders to the glue, the light transmittance is very poor, and the light transmittance is less than 90%.

Method used

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  • LED packaging glue and preparation method thereof
  • LED packaging glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A preparation method of LED encapsulation glue, is characterized in that, comprises the steps:

[0027] a) Preparation of component A base glue: Add 15% by mass percentage of the first vinyl silicone oil and 83% by mass percentage of the first vinyl MQ silicone resin into the reaction vessel, and pump it under normal temperature of 20-25°C Vacuum stirring, until the stirring is uniform, add the platinum catalyst with a mass percentage of 2% into the reaction vessel, and obtain the A-component base glue;

[0028] b) Preparation of B-component base glue: add 20% by mass of methyl hydrogen silicone oil, 14.95% by mass of second vinyl silicone oil and 60% by mass of second vinyl in the reaction vessel MQ silicone resin, under the condition of normal temperature 20-25°C, vacuumize and stir it, and after stirring evenly, add 0.05% by mass of ethynylcyclohexanol and 5% by mass of tackifier to the reaction vessel in sequence, That is, the B-component base glue is obtained;

...

Embodiment 2

[0037] Same as Example 1, the difference is:

[0038] In step a: (by mass percentage) the first vinyl silicone oil is 20%, the first vinyl MQ silicone resin is 79%, and the platinum catalyst is 1%, wherein the vinyl content in the first vinyl MQ silicone resin is 2.3%;

[0039] In step b: (by mass percentage) methyl hydrogen-containing silicone oil is 25%, the second vinyl silicone oil is 15.95%, the second vinyl MQ silicone resin is 55%, ethynyl cyclohexanol is 0.05%, SC- 101 is 4%.

[0040] In step c: the mass ratio of the A-component base glue to the B-component base glue is 1:1, and the curing conditions are a curing temperature of 25°C and a curing time of 18 hours.

Embodiment 3

[0042] Same as Example 1, the difference is:

[0043] In step a: (by mass percentage) the first vinyl silicone oil is 25%, the first vinyl MQ silicone resin is 74.5%, and the platinum catalyst is 0.5%, wherein the vinyl content in the first vinyl MQ silicone resin is 2.3%;

[0044] In step b: (by mass percentage) 30% of methyl hydrogen-containing silicone oil, 16.95% of second vinyl silicone oil, 50% of second vinyl MQ silicone resin, 0.05% of ethynyl cyclohexanol, SC- 101 is 3%.

[0045] In step c: the mass ratio of the A-component base glue to the B-component base glue is 2:1, and the curing conditions are a curing temperature of 30°C and a curing time of 24 hours.

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Abstract

The invention relates to LED packaging glue and a preparation method thereof, and belongs to the field of glues. The preparation method comprises the following steps: firstly, adding first vinyl silicone oil and first vinyl MQ silicon resin in a reaction vessel and stirring , and adding platinum catalyzer to the reaction vessel under the condition of normal temperature and vacuum to obtain separation base glue of group A; secondly, adding methyl hydrogen silicone oil, second vinyl silicone oil and second vinyl MQ silicon resin in sequence to the reaction vessel and stirring, and adding 1-Ethynyl-1-cyclohexanol and tackifier in sequence under the condition of normal temperature and vacuum to obtain separation base glue of group B; and finally, mixing the separation base glue of group A obtained in step a and the separation base glue of group B obtained in step b at mass radio of 0.5:1 to 2:1, and solidifying to obtain the LED packaging glue. The LED packaging glue provided by the invention has the advantages of good liquidity, high transparence, good flexibility, good weathering resistance, non-yellowing, adaptability to high-and-low temperature and the like.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to an LED packaging adhesive and a preparation method thereof. Background technique [0002] LED light strip potting glue is widely used in the surface packaging of LED soft light strips, the special potting of hard light strips, piranha lights, Great Wall lights and other LED lighting lamps, to protect the waterproof insulation of electronic components, coating circuits The moisture-proof effect of the board. [0003] At present, the LED flexible light strip glue on the market basically adopts epoxy resin encapsulant, PU polyurethane encapsulant, condensed (10:1) or (4:1) silica gel, but these encapsulants have poor yellowing resistance and high resistance. Poor low temperature performance or poor tear strength and other shortcomings, this type of encapsulant has high transparency, good flexibility, good weather resistance, non-yellowing characteristics and excellent high and low temperat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05
Inventor 过蓉晖程云涛
Owner SHENZHEN JINLIAN TECH
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