High temperature self-repairing conductive silver adhesive and preparation method thereof

Abstract

The invention provides a high temperature self-repairing conductive silver adhesive. The high temperature self-repairing conductive silver adhesive is prepared from the following raw constituents by parts: 100 parts of epoxy resin, 10-30 parts of curing agent, 10-40 parts of epoxy diluent, 240-990 parts of silver pieces, 3-20 parts of coupling agent and 5-20 parts of self-repairing microcapsule; wherein the self-repairing microcapsule is composed of the following raw constituents by parts: 100 parts of epoxy resin, 8-20 parts of latent curing agent, 30-60 parts of diluents, 0.5-2.5 parts of emulsifying agent, 500-800 parts of nano silver wires, 5-16 parts of coupling agent, 60-120 parts of capsule wall material, 0.5-2 parts of antifoaming agent and 150-900 parts of deionized water. The invention also provides a preparation method of the high temperature self-repairing conductive silver adhesive. The high temperature self-repairing conductive silver adhesive has the positive effects that the repairing efficiency is high, the repairing effect is expanded on the basis of the original conductive network, crack-conductive network double repairing is realized, and the long-term using effect of the conductive adhesive is guaranteed, the cost is saved, and the reliability and service life of the conductive adhesive in high temperature working environment are improved.

Description

technical field [0001] The invention relates to a conductive adhesive, more specifically to a conductive silver adhesive capable of self-repairing under high temperature conditions and a preparation method thereof. Background technique [0002] In the field of microelectronic assembly, conductive adhesive is one of the options to replace traditional Pb / Sn solder. Compared with traditional Ph / Sn solder, conductive adhesive can achieve high line resolution, and has the characteristics of simple process, easy operation, high production efficiency, etc., and also avoids environmental pollution caused by heavy metal lead in tin-lead solder. As an interconnect material, conductive adhesive plays a role of heat conduction and conduction, so its connection reliability is very important for the long-term stable operation of connected devices. However, there are still some unresolved problems in the reliability of conductive adhesives, such as: limited impact resistance, instability ...

AI Technical Summary

Problems solved by technology

However, at present, the self-healing technology of microcapsules is mostly used in the application of composite materials, and there are few researches and patents on self-healing conductive adhesives at home and abroad.

[0004] On the other hand, with the further improvement of the operating frequency of semiconductor devices, the increase of power capacity, the improvement of efficiency and reliability, especially the higher and higher integration, the trend of devices becoming smaller and lighter Development, which leads to more and more heat generated on the device, and the conductive adhesive is often used under high temperature conditions and then fails. At present, 65% of package failures can be attributed to mechanical problems under temperature and humidity loads

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