Environment-friendly II-VI class soft fragile crystal grinding and polishing method

Abstract

The invention belongs to the technical field of processing and manufacturing of II-VI class soft fragile crystals and discloses an environment-friendly II-VI class soft fragile crystal grinding and polishing method. The method is characterized in that samples are II-VI class soft fragile crystals, waterproof sand paper is made by adopting fixed abrasive, a fixed abrasive millstone is taken as a grinding tool, abrasive includes alumium oxide, ceric oxide and silicon dioxide, the grain size is 2000-5000, the rotating speed of both a workpiece and a grinding disc is 40-80rpm, the pressure is 15-20kPa, grinding fluid is deionized water, grinding time is 3-10min, chemical mechanical polishing solution is composed of silica solution and hydrogen peroxide, the pH value of the silica solution is 6-8, the grain size of silicon dioxide is 50-80nm, pH regulator is one of orange juice, grapefruit juice, haw juice, tomato juice and lemon juice, the pH value of the polishing solution after being adjusted is 4-6, the rotating speed of both the workpiece and a polishing disc is 40-80rpm, the pressure is 20-30kPa, and the polishing time is 20-40min. The environment-friendly II-VI class soft fragile crystal grinding and polishing method has the advantage that environment-friendly grinding and polishing of the II-VI class soft fragile crystals are realized.

Description

technical field [0001] The invention discloses a grinding and polishing method for group II-VI soft and brittle crystals, which belongs to the technical field of processing and manufacturing II-VI group soft and brittle crystals, and in particular relates to a method for processing semiconductor wafers of II-VI group soft and brittle crystals. Background technique [0002] II-VI group soft and brittle crystals are widely used in military, national defense, aerospace and other high-tech fields, and have become the focus and hotspot of research at home and abroad. CdZnTe and HgCdTe are typical representatives of II-VI group soft and brittle crystals. Cadmium zinc telluride is the preferred material for room temperature nuclear radiation detectors, and it is also an ideal material for mercury cadmium telluride infrared thin film substrates. Mercury cadmium telluride is the material of choice for infrared detectors, especially the most widely used material for infrared focal pl...

AI Technical Summary

Problems solved by technology

This method of free abrasive grinding and polishing makes abrasives easily embedded in the surface of the workpiece, once embedded it is difficult to remove

Even if it is removed, processing defects such as pits, micro-deformation, and micro-scratches will remain

The final chemical mechanical polishing method uses bromomethanol as the final etchant. Although it can remove the mechanically processed damage layer on the surface, it will leave corrosion grooves at the same time, and it is difficult for large scratches caused by free abrasive grinding. remove

[0004] Although soft and brittle crystals of the II-VI group are prone to various processing defects, the processed surface of the II-VI group semiconductor wafer requires no abrasive embedding, scratches, chipping, broken and other processing defects, and requires its surface roughness Reaching the sub-nanometer level, this harsh requirement poses a severe challenge to the field of precision ultra-precision machining in my country