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Stabilized silver catalysts and methods

A technology of silver ions and compositions, applied in chemical instruments and methods, physical/chemical process catalysts, silver compounds, etc., can solve the problems of no copper production, no activity, etc.

Inactive Publication Date: 2013-07-24
DOW GLOBAL TECH LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although silver-based catalyst solutions have been previously reported, they have not been commercially successful because they do not always satisfy any of the above factors
Most typically, silver catalyst solutions do not provide sufficient activity in vias for electroless copper plating
It may be a function of the amount of catalyst uptake in the via or the trigger ratio of the electroless plating produced by the catalyst; but in either case the result is insufficient copper coverage in the subsequent electrolytically plated via

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Preparing the Activation Bath

[0047] Into a 1 L glass beaker containing 700 mL of deionized water was added 13.6 g of 4-dimethylaminopyridine and 9 g of potassium dihydrogen phosphate. The solution was stirred accurately at room temperature and the pH was adjusted to 7 by adding 1 M potassium hydroxide solution. 6 g of tin(II) sulfate were added and stirring was continued for five minutes. The white precipitate was removed by filtration using a 1.5 micron G6 Fisher glass fiber filter, and then 40 mL of a 73.6 mmol silver nitrate solution was added dropwise to deionized water while the solution was mixed with a homogenizer at 6000 rpm. Addition of the silver solution resulted in an immediate color change to dark reddish brown. The pH of the resulting 300 ppm metallic silver solution was raised from 7 to 9 by adding 1 M potassium hydroxide solution. Absorption of the activated solution on the lace carbon support followed by analysis by high-resolution transmission el...

Embodiment 2

[0049] Via Screening Program

[0050] Prepare six NP-175, TU-752, Shengyi1000-2, Shengyi-1141, FR-406, 370HR type 8-ply multilayer laminates with pre-drilled holes. The pre-drilled through holes have a diameter of 10 mm. The board was processed through the workflow described below.

[0051] 1. Use CIRCUPOSIT for the through holes of each board TM MLB Conditioner 211 (available from Dow Electronic Materials) was desmeared at 80°C for 7 minutes and rinsed in cold tap water for 4 minutes.

[0052] 2. Then use the PROMOTER for the through hole TM The 213 alkaline permanganate formulation (available from Dow Electronic Materials) was treated at 80°C for 10 minutes and rinsed in cold tap water for 4 minutes.

[0053] 3. Then use NEUTRALIZER for the through holes on the circuit board TM Composition 213 (available from Dow Electronic Materials) was treated with a mixture of hydrogen peroxide and sulfuric acid at 46°C for 5 minutes and rinsed with cold tap water.

[0054] 4. The...

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Abstract

Zero-valent silver compositions include 4-dimethylaminopyridine as stabilizers. The zero-valent silver and the 4-diemthylaminopyridine form stabilized nano-particles in solution. The zero-valent silver compositions may be used as catalysts in the metallization of nonconductive substrates.

Description

technical field [0001] The present invention is directed to stable silver catalysts and methods for the electroless plating of metals on non-conductive substrates. More specifically, the present invention is directed to stabilized silver catalysts, and methods of electroless plating metals on non-conductive substrates, wherein the silver catalysts are stabilized with 4-dimethylaminopyridine. Background technique [0002] During the fabrication of multilayer printed wiring boards (PWBs), the assimilation of multiple patterned conductive copper layers requires separation by dielectric materials. To create interconnected vias between the copper layers, vias are drilled in the conductive material, copper is plated to cover the dielectric material, and the copper intervening layers are connected. Existing methods of copper plating throughout a drilled hole require making the via conductive so that it can be subsequently electrolytically plated with copper. The most common metho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01J31/26B01J31/28B01J31/38C23C18/44C25D7/04C23C28/02
CPCC23C18/285C23C18/1831C23C18/1844C23C18/1879C23C18/2086C23C18/1893C23C18/1653C23C18/30B01J23/50C01G5/00C07D213/72C23C18/18
Inventor K·F·希尔斯考恩
Owner DOW GLOBAL TECH LLC
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