Contour machining method of metal heat conduction block

Abstract

The invention relates to the field of metal matrix PCBs, in particular to a contour machining method of a metal heat conduction block. The method includes the following steps: a punch die is manufactured according to the shape of a metal block, and the design size of the punch die is larger than the size of the metal block; a copper plate is placed on the die for punching to obtain metal block workblank with the size larger than a needed size; at least two pieces of metal block workblank are overlapped and placed on a clamping platform, and a numerical control machine milling technology is used for milling the peripheral edge of the metal block so that metal block fine workblank with the needed size can be obtained; the metal block fine workblank is polished; cleaning and deoxidation are conducted on the surface of the metal block fine workblank to obtain the metal heat conduction block. In the punching process of the metal block, the edge of the metal block is prevented from being extended, being thinned and collapsing, the surface of the small size metal block which is machined and formed is smooth and clean, collapsing does not occur to the edge of the metal block, the machine-shaping efficiency of the metal block and the utilization rate of materials are improved, material consumption is lowered, and the quality of the metal block is effectively guaranteed.

Description

technical field [0001] The invention relates to the field of metal-based printed circuit boards (PCBs), in particular to a method for forming and processing metal heat-conducting blocks for composite heat-conducting PCB boards. Background technique [0002] With the rapid development of modern electronic technology in the direction of multi-function, miniaturization and high power, the traditional design of electronic appliances can no longer meet the requirements of increasingly complex high-end electronic equipment for the high density of electronic appliances and the integration of multi-functional design. The heat conduction, electrical performance, mechanical performance and other special performance requirements of power amplifier devices of high-power electronic equipment have increasingly become an important part of the performance indicators of electronic products. [0003] However, in terms of the heat dissipation of the PCB substrate, its requirements are becoming...

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Problems solved by technology

[0005] Copper-based copper-clad laminates have the basic properties of aluminum-based copper-clad laminates. Large, high value, easy to oxidize, so its application is limited, and the amount used is far lower than that of aluminum-based copper-clad laminates; although the thermal conductivity of metal-based PCB substrates is good, the power device mounted on the metal-based PCB and the metal-based Also across the PCB board with poor thermal conductivity, the heat generated by high-power devices cannot be effectively conducted to the metal base. In order to improve its heat conduction effect, Chinese Patent Publication No. CN102933041A discloses the production of a composite heat-conductive PCB board method, but higher requirements are put forward for the specifications of its small-sized copper block (size less than or equal to 70mm×80mm). The existing processing method is not only complicated in process, high in manufacturing cost, low in production efficiency, but also difficult to meet the requirements in processing accuracy. , when punching, under the action of punching force, the edge of the copper block is easy to stretch, thin or collapse, which seriously affects the quality of composite heat-conducting PCB board products

At present, the industry mostly adopts the linear cutting method for small-sized copper blocks, and the processing efficiency and copper utilization rate are low. The edge of the processed copper block has defects such as burrs and burrs, and it is difficult to meet the use requirements.

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