Heat seal cover tape and preparation method of heat seal cover tape

A cover tape and heat-sealing layer technology, applied in chemical instruments and methods, synthetic resin layered products, layered products, etc., can solve the problems of high production technology and equipment requirements, complex product structure, and high price, and achieve excellent The effect of heat sealability, low production cost and low production equipment requirements

Inactive Publication Date: 2013-09-04
JINGJIANG RUITAI ELECTRIC MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Cover tape is an indispensable material for packaging in the electronics industry. At present, the country mainly relies on imports from Japan, the United States and South Korea. These cover tapes generally have disadvantages such as complex product structure, high requirements for production technology and equipment, and expensive prices.

Method used

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  • Heat seal cover tape and preparation method of heat seal cover tape
  • Heat seal cover tape and preparation method of heat seal cover tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Substrate film layer: Biaxially oriented polyethylene terephthalate film, thickness 16 μm.

[0026] Primer coating: The primer prepared by grafting maleic anhydride with styrene-butadiene-styrene block copolymer is directly coated on the substrate film through a gravure roller coater, and the coating thickness is 5 μm .

[0027] Heat-sealing layer: apply the heat-sealing agent directly on the primer layer through a knife coater, with a coating thickness of 30 μm.

[0028] The formula of heat sealing agent is as follows, the unit is gram;

[0029] Styrene-butadiene-styrene block copolymer 100

[0030] hydrogenated C 9 Petroleum resin 10

[0031] Rosin modified phenolic resin 10

[0032] Polyethylene wax 5

[0033] Polyamide Wax 2

[0034] Toluene 300

[0035] Ethyl acetate 100

[0036] Heat-sealing agent preparation process: Add polyethylene wax, polyamide wax and toluene into the reaction kettle, dissolve at 90°C for 1 hour; cool down to 60°C, add styrene-butad...

Embodiment 2

[0039] Substrate film layer: biaxially stretched polyethylene terephthalate film, thickness 20 μm.

[0040] Primer coating: The primer prepared by grafting acrylic acid with styrene-butadiene-styrene block copolymer is directly coated on the substrate film with a coating thickness of 5 μm through a gravure roller coater.

[0041] Heat-sealing layer: apply the heat-sealing agent directly on the primer layer through a knife coater, with a coating thickness of 25 μm.

[0042] The formula of heat sealing agent is as follows, the unit is gram;

[0043] Styrene-butadiene-styrene block copolymer 100

[0044] hydrogenated C 9 petroleum resin 5

[0045] Terpene-styrene resin 5

[0046] Terpene-phenolic resin 10

[0047] Polyethylene wax 5

[0048] Polyamide Wax 2

[0049] Toluene 400

[0050] Heat-sealing agent preparation process: Add polyethylene wax, polyamide wax and toluene into the reaction kettle, dissolve at 90°C for 1 hour; cool down to 60°C, add styrene-butadiene-styr...

Embodiment 3

[0053] Substrate film layer: biaxially stretched polyethylene terephthalate film, thickness 20 μm.

[0054] Primer coating: The primer prepared by grafting methacrylic acid with styrene-butadiene-styrene block copolymer is directly coated on the substrate film through a gravure roller coater, and the coating thickness is 5 μm .

[0055] Heat-sealing layer: apply the heat-sealing agent directly on the primer layer through a knife coater, with a coating thickness of 30 μm.

[0056] The formula of heat sealing agent is as follows, the unit is gram;

[0057] Styrene-butadiene-styrene block copolymer 100

[0058] Rosin modified phenolic resin 5

[0059] Terpene-styrene resin 10

[0060] Terpene-phenolic resin 10

[0061] Polypropylene Wax 5

[0062] Polyamide Wax 2

[0063] Toluene 300

[0064] Ethyl acetate 100

[0065] Heat-sealing agent preparation process: Add polypropylene wax, polyamide wax and toluene to the reaction kettle, dissolve at 90°C for 1 hour; cool down to...

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Abstract

The invention discloses a heat seal cover tape and a preparation method of the heat seal cover tape, belonging to the package field of electronic parts and components. A bottom coating is arranged above a base material film layer of the heat seal cover tape; a heat seal layer is arranged above the bottom coating; and the heat seal cover tape is prepared by coating through a coating machine. According to the heat seal cover tape, the production technology is simple and the requirement on production equipment is low. The heat seal cover tape has excellent heat seal property, proper peel strength, even peeling force, high light transmittance, anti-bonding property, high temperature resistance, high humidity resistance, anti-aging performance and enough tensile strength. The heat seal cover tape is suitable for being arranged on a carrier tape made from polystyrene, polycarbonate, polyethylene glycol terephthalate plastic and the like in a way of heat seal. According to the heat seal cover tape and the preparation method of the heat seal cover tape, the problems that the product has dependence on import, high in price and the like can be solved.

Description

technical field [0001] The invention relates to the field of packaging of electronic components, in particular to a heat-sealing cover tape and a preparation method thereof. Background technique [0002] In recent years, in the assembly process of electronic equipment, electronic components are stored in a carrier tape with a continuous embossed pocket, and the heat-sealed cover tape is sealed on the surface of the carrier tape under heating to form a closed space. Play the role of protecting the electronic components in the carrier tape pocket. [0003] The production of electronic components in my country has become the third largest production base after the United States and Japan. In 2012, the national output of electronic components reached 2.5 trillion pieces. Cover tape is an indispensable material for packaging in the electronics industry. At present, the country mainly relies on imports from Japan, the United States and South Korea. These cover tapes gener...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/08B32B27/36
Inventor 唐建仁王建涛王寅
Owner JINGJIANG RUITAI ELECTRIC MATERIAL
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