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adhesive tape

A technology of adhesive tape and bonding part, which is applied in the direction of adhesives, film/sheet adhesives, electrical components, etc., can solve problems such as chip damage, poor chip retention, and inability to fully prevent chips from flying out. To achieve the effect of preventing chips from flying out

Active Publication Date: 2016-01-20
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the chip becomes thinner, the strength of the chip becomes weaker. Therefore, if the conventional adhesive tape is used for dicing and picking up, the chip strength may be weaker than the adhesive force of the adhesive tape and the chip may be damaged.
[0007] Therefore, although the adhesive force can be reduced, and the workpiece can be fixed and held with an adhesive force that does not cause damage to the chip, a defective chip smaller than the desired chip size can be formed at the peripheral edge of the workpiece, and the The adhesive area (the area in contact with the adhesive tape) is small, so that the holding force of each defective chip is weak, and the resulting problem is that the occurrence of chip flying cannot be sufficiently prevented

Method used

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Examples

Experimental program
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Effect test

no. 1 Embodiment approach

[0095] Such as figure 1 (a), figure 1 As shown in (b), the adhesive tape 1 has a long shape, is wound into a roll during storage, and is fed out from the roll during use.

[0096] The adhesive tape 1 is mainly composed of a base film 10 and an adhesive layer 20 . The adhesive tape 1 has a structure in which the adhesive layer 20 is formed on the base film 10 and the adhesive layer 20 is supported by the base film 10 .

[0097] The base film 10 is made of plastic, rubber, or the like, and when the adhesive layer 20 includes a radiation-polymerizing component, the base film 10 is preferably made of a material with good radiation transmittance.

[0098] Examples of polymers that can be selected as the constituent material of the base film 10 include polyethylene, polypropylene, ethylene-propylene copolymer, poly-1-butene, and poly-4-methyl-1-pentene. , ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-acrylic acid...

no. 2 Embodiment approach

[0187] The second embodiment differs from the first embodiment mainly in the following points, and other configurations and functions are the same as those of the first embodiment.

[0188] The adhesive tape 1 of the present embodiment is a dicing tape for die bonding, such as Figure 12 As shown in (a), the adhesive layer 100 is formed on the adhesive layer 20 .

[0189] The adhesive layer 100 is in close contact with the adhesive layer 20 , and when the chip 36 is picked up, the adhesive layer 100 is peeled off from the adhesive layer 20 while attached to the chip 36 .

[0190] The material used for the adhesive layer 100 is not particularly limited, and known polyimide resins, polyamide resins, polyetherimide resins, polyamideimide resins, poly Ester resin, polyesterimide resin, polyphenylene ether resin, polysulfone resin, polyethersulfone resin, polyphenylene sulfide resin, polyether ketone resin, chlorinated polypropylene resin, acrylic resin, polyurethane resin, epoxy ...

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Abstract

PURPOSE: An adhesive tape is provided to prevent the scattering of a chip in the peripheral part of a work when dicing the work. CONSTITUTION: An adhesive tape (1) includes an adhesive layer (20) on which a work is attached and a substrate film (10) supporting the adhesive layer. The adhesive layer has a first region corresponding to the peripheral part of the work and a second region corresponding to a part where a chip is formed from the work. Provided that an adhesion to the first region is represented by A and an adhesion to the second region is represented by B, the condition A>B is satisfied. The light transmittancy in the first region is different from those of other regions.

Description

technical field [0001] The present invention relates to an adhesive tape, and particularly relates to an adhesive tape suitable for use in cutting of workpieces (to-be-processed objects). Background technique [0002] For semiconductor wafers formed with predetermined circuit patterns such as IC (integrated circuits) or semiconductor packages formed by casting ICs with resin, the method of rotating the cutter with metal particles dispersed at high speed, etc., is diced by a rotary blade into a predetermined pattern. Die size, and then further take various treatments such as cleaning or drying, expansion, picking, die bonding, etc. In these steps, usually, a workpiece such as a wafer or a package is fixed and held by an adhesive tape having an adhesive layer attached to the base film, and then diced or picked up. Patent Document 1 discloses a related adhesive tape. An example of a belt. [0003] However, in the cutting process, a thin blade rotating at a high speed of tens ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/02H01L21/683H01L21/301
CPCC09J7/22C09J7/30C09J7/38C09J2203/326C09J2301/204C09J2301/208C09J2301/302H01L21/6836H01L2221/68327
Inventor 青山真沙美丸山弘光
Owner FURUKAWA ELECTRIC CO LTD