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Preparation method of high-heat-conducting polyphenylene sulfide material and prepared material

A technology of polyphenylene sulfide and polyphenylene sulfide resin, applied in the field of preparation methods and prepared materials, can solve the problem of reducing the molecular regularity and crystallinity of polyphenylene sulfide, reducing the thermal conductivity of polyphenylene sulfide resin, and destroying molecular Problems such as large conjugated structure, to achieve the effect of preventing the reduction of thermal conductivity, reducing the dosage, and low dosage

Active Publication Date: 2013-09-25
SICHUAN COREMER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to aim at the fact that existing polyphenylene sulfide is prone to cross-linking during processing, which greatly reduces the regularity and crystallinity of polyphenylene sulfide molecules, destroys the large conjugated structure of the molecule, and affects The formation of heat conduction channel is solved, the problem of thermal conductivity of polyphenylene sulfide resin is reduced, and a preparation method and prepared material of polyphenylene sulfide material with high thermal conductivity are provided

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] (1) Preparation of high crystallinity polyphenylene sulfide resin

[0039] The linear polyphenylene sulfide resin was baked at 130°C for 3 h and set aside. Weigh 95 kg of linear polyphenylene sulfide resin, 4 kg of α,ω-bis(imidazolidinone nitroxide) phenyl polyether and 1 kg of β-(3,5-di-tert-butyl-4-hydroxyphenyl ) n-octadecyl propionate, linear polyphenylene sulfide resin, α, ω-bis(imidazoline nitrone nitrogen oxide) phenyl polyether and β-(3, 5-di-tert-butyl-4- Add n-octadecyl hydroxyphenyl) propionate into a high-speed batching mixer and mix evenly. The speed of the high-speed batching mixer is 480-960 r / min, and the mixing time is 3-5 minutes to obtain a primary premix.

[0040] The primary premix is ​​placed in a twin-screw machine, and the primary premix is ​​melted and extruded by the twin-screw machine, then cooled by water, dried by hot air, and sheared and granulated by a pelletizer to obtain high-crystallinity polyphenylene sulfide resin granulation, in wh...

Embodiment 2

[0048] (1) Preparation of high crystallinity polyphenylene sulfide resin

[0049] The linear polyphenylene sulfide resin was baked at 130°C for 3 h and set aside. Weigh 95 kg of linear polyphenylene sulfide resin, 4 kg of α,ω-bis(imidazolidinone nitroxide) phenyl polyether and 1 kg of β-(3,5-di-tert-butyl-4-hydroxyphenyl ) n-octadecyl propionate, linear polyphenylene sulfide resin, α, ω-bis(imidazoline nitrone nitrogen oxide) phenyl polyether and β-(3, 5-di-tert-butyl-4- Add n-octadecyl hydroxyphenyl) propionate into a high-speed batching mixer and mix evenly. The speed of the high-speed batching mixer is 480-960 r / min, and the mixing time is 3-5 minutes to obtain a primary premix.

[0050] The primary premix is ​​placed in a twin-screw machine, and the primary premix is ​​melted and extruded by the twin-screw machine, then cooled, dried, and pelletized by a pelletizer to obtain granular high-crystallinity polyphenylene sulfide resin , wherein the temperature of the twin-scr...

Embodiment 3

[0059] (1) Preparation of high crystallinity polyphenylene sulfide resin

[0060]The linear polyphenylene sulfide resin was baked at 130°C for 3 h and set aside. Weigh 95 kg of linear polyphenylene sulfide resin, 4 kg of α,ω-bis(imidazolidinone nitroxide) phenyl polyether and 1 kg of β-(3,5-di-tert-butyl-4-hydroxyphenyl ) n-octadecyl propionate, linear polyphenylene sulfide resin, α, ω-bis(imidazoline nitrone nitrogen oxide) phenyl polyether and β-(3, 5-di-tert-butyl-4- Add n-octadecyl hydroxyphenyl) propionate into a high-speed batching mixer and mix evenly. The speed of the high-speed batching mixer is 480-960 r / min, and the mixing time is 3-5 minutes to obtain a primary premix.

[0061] The primary premix is ​​placed in a twin-screw machine, and the primary premix is ​​melted and extruded by the twin-screw machine, then cooled by water, dried by hot air, and cut and granulated by a pelletizer to obtain granular high-crystallinity polyphenylene Thioether resin. Among them...

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Abstract

The invention discloses a preparation method of a high-heat-conducting polyphenylene sulfide material and the prepared material. The preparation method aims at solving the problems that when conventional polyphenylene sulfide is processed, as cross linkage is easily caused, the regularity and the crystallinity of polyphenylene sulfide molecules are greatly reduced, the molecular large conjugated structure is damaged, the formation of a heat conduction channel is influenced, and the heat conduction property of polyphenylene sulfide resin is reduced. The preparation method comprises the steps of high-crystallinity polyphenylene sulfide resin preparation, high-heat-conducting fiber preparation and high-heat-conducting polyphenylene sulfide material preparation. The high-heat-conducting polyphenylene sulfide material prepared by the method has the characteristics that the using amount of heat-conducting packing is little, the heat-conducting coefficient is greater than 5w / m.k, and the overall performances such as mechanical property are excellent. As the high-heat-conducting polyphenylene sulfide material has the characteristics of high heat-conduction property and high heat resistance as well as excellent mechanical property, the high-heat-conducting polyphenylene sulfide material can be applied to structures and heat dissipation parts of electron devices such as LEDs (Light Emitting Diodes), LCD (Liquid Crystal Displays) and mobile phones.

Description

technical field [0001] The invention relates to the field of materials, especially the field of polymer materials, and specifically relates to a method for preparing a high thermal conductivity polyphenylene sulfide material and the prepared material. Background technique [0002] In recent years, with the rapid development of electronic assembly technology and packaging technology, the assembly density has been greatly increased. While the volume of electronic components and circuits has been reduced by tens of thousands of times, the corresponding operating frequency has increased sharply, resulting in a sharp decline in its working stability. . For example, in the computer field, as the operating frequency and speed of the CPU increase substantially, the heat generated by the CPU increases exponentially. According to the Arhennius formula, for every 10°C increase in temperature, the life of electronic components will be reduced by 1 / 2. Therefore, in order to ensure that...

Claims

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Application Information

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IPC IPC(8): C08L81/02C08K9/02C08K7/06C08K3/04B29C47/92B29C48/92
CPCB29C48/04B29C48/40B29C48/875B29C48/92B29C2948/92704B29C2948/92895
Inventor 刘涛杨克斌刘光耀余国贤
Owner SICHUAN COREMER CO LTD
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