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Epitaxial structure and growth method for improving wavelength concentration in Gan-based epitaxial wafers

A technology of epitaxial structure and growth method, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of uneven growth surface and adverse effects of wavelength concentration of LED epitaxial wafers, and achieve enhanced yield, improved wavelength concentration, and reduced The effect of the degree of warpage

Active Publication Date: 2016-08-10
宁波安芯美半导体有限公司
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  • Application Information

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Problems solved by technology

However, heterogeneous epitaxy will have adverse effects on LEDs. Take sapphire substrates as an example: there is a large lattice mismatch and thermal mismatch between sapphire and GaN materials, and the epitaxial wafers are warped by high temperatures during growth. curved, making the growth surface of the film not an ideal plane, which has an adverse effect on the concentration of wavelengths in the LED epitaxial film

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  • Epitaxial structure and growth method for improving wavelength concentration in Gan-based epitaxial wafers

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Embodiment Construction

[0012] The embodiments of the present invention are described in detail below: the present embodiment is implemented under the premise of the technical solution of the present invention, and detailed implementation and specific operation process are provided, but the protection scope of the present invention is not limited to the following implementation example.

[0013] Such as figure 1 The LED epitaxial structure shown, from bottom to top, includes: substrate 1, low temperature GaN buffer layer 2, GaN undoped layer 3, Al x Ga 1-x N(0.05<x<0.25) layer 4, n-type GaN layer 5, multi-quantum well structure MQW 6, multi-quantum well active layer 7, low-temperature p-type GaN layer 8, p-type AlGaN layer 9, high-temperature p-type GaN layer 10 and the P-type contact layer 11.

[0014] Step 1: Anneal the 4inch substrate 1 in a hydrogen atmosphere, clean the substrate surface, control the temperature between 1000-1200°C, and then perform nitriding treatment on the surface of the s...

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Abstract

An epitaxial structure for improving wavelength concentration in a GaN-based epitaxial wafer and a growth method of the epitaxial structure are provided. The epitaxial structure comprises the following portions form bottom to up: a substrate, a low-temperature GaN buffer layer, a GaN non-doped layer, an ALxGa1-xN insertion layer, an N-type GaN layer, a multi-quantum well (MQW) structure, a multi-quantum well active layer, a low-temperature P-type GaN layer, a P-type AlGaN layer, a high-temperature P-type GaN layer and a P-type contact layer. The epitaxial structure is characterized in that the ALxGa1-xN layer is inserted behind the GaN non-doped layer; after the ALxGa1-xN layer is inserted into the epitaxial structure, when the GaN non-doped layer is grown, the flow of the GaN non-doped layer is decreased by 10% to 30% compared with a situation where the ALxGa1-xN layer is not inserted in the epitaxial structure; and after the ALxGa1-xN layer is inserted in the epitaxial structure, when the N-type GaN layer is grown, the flow of the N-type GaN layer is decreased by 0 to 20% compared with the situation where the ALxGa1-xN layer is not inserted in the epitaxial structure. The growth method of the epitaxial structure of the invention can effectively improve the wavelength concentration in an LED epitaxial wafer.

Description

technical field [0001] The invention belongs to the technical field of III-VI nitride material preparation, and in particular relates to a novel GaN epitaxial structure, an epitaxial structure capable of effectively improving the wavelength concentration in a GaN-based epitaxial wafer and a growth method thereof. Background technique [0002] A light emitting diode (LED, Light Emitting Diode) is a semiconductor solid light emitting device, which uses a semiconductor PN junction as a light emitting material, and can directly convert electrical energy into light energy. When a forward voltage is applied to both ends of the semiconductor PN junction, the minority carriers and majority carriers injected into the PN junction recombine, and the recombined energy is emitted in the form of light, which can form light of various colors. [0003] Group III-VI materials represented by GaN belong to wide bandgap semiconductor materials, and have been developed rapidly since the 1990s. ...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/12H01L33/00
Inventor 杨奎牛勇吴礼清李刚郭丽彬蒋利民
Owner 宁波安芯美半导体有限公司