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Methods of modifying metal-oxide nanoparticles

A technology of nanoparticles and oxides, applied in nanotechnology, nanotechnology, nanostructure manufacturing, etc., can solve problems such as unsuitable refractive index and optical transparency

Inactive Publication Date: 2013-10-09
DOW CORNING TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, many of the aforementioned encapsulants using conventional metal oxide particles have a refractive index and optical clarity that make them unsuitable for use in LEDs

Method used

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  • Methods of modifying metal-oxide nanoparticles
  • Methods of modifying metal-oxide nanoparticles
  • Methods of modifying metal-oxide nanoparticles

Examples

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example

[0086] Example of Preparation of Modified Nanoparticles. Specifically, Examples 1, 2 and 3 were prepared. The method of preparing Examples 1, 2 and 3 relates to the first example of the invention. Each instance is described in detail next.

example 1

[0088] A three necked round bottom flask equipped with stirrer, addition funnel, thermometer and Dean Stark trap with condenser was charged with 14.88 g PhSi(OMe) 3 and 12.30 g sol. The sol is zirconium (ZrO 2 ) sol comprising 10% by weight ZrO 2 / toluene solution, and modifiers. The sol had a solids content of 16.6% by weight after 1 hour at 150°C. The composition of the modifier is proprietary and thus unknown, although the modifier is believed to be a surfactant, present in an amount of about 7% by weight. The actual diameter of the nanoparticles is 7 nm. The appearance of the sol was slightly cloudy. The sol is commercially available from Sumitomo Osaka Cement Co., Ltd. Without wishing to be bound or bound by any particular theory, it is believed that the presence of the modifying agent (eg, surfactant) in the sol is particularly beneficial in forming a subsequent homogeneous composition.

[0089] Next, will contain 4.21g water, 1.47g (ViMe 2 Si) 2 A solution of O...

example 2

[0094] Example 2 was prepared in a similar manner to Example 1. The products explored are Vi m 0.15 Ph T 0.75 [ZiO 2 ] 0.10 . Relative to Example 1, KOH equilibration was performed in Example 2 for 16 hours instead of 8 hours. Also, after removing the solvent, the product was a sticky solid rather than a flaky solid.

[0095] The product of Example 2 was tested by IR spectroscopy, GPC and NMR by methods known in the art. For IR, observed at 898cm -1 greater absorption. No Si-O-Zr formation was identified. For GPC, relative to the product of Example 1, the molecular weight was much lower and multimodal. GPC testing usually involves the use of CHCl 3 , TSK gel XL-L. For NMR, much more SiOH than Example 1 is present. for 29 Si NMR using D 4 As an internal standard, this yielded a resin content of 81.9% by weight per solid. From this the vinyl content of each solid was determined. The rest of the solid is assumed to be from ZrO 2 , and 50% by weight of the modif...

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Abstract

Methods employing acidic and basic catalysts are disclosed, and generally entail hydrolysis and condensation reactions of silicon based components. The methods are useful for forming siloxane-modified metal-oxide nanoparticles, such as modified ZrO2 nanoparticles. The siloxane-modified metal-oxide nanoparticles, and products including the siloxane-modified metal-oxide nanoparticles, can be used to form various products, such as lenses or encapsulants for making various devices, such as, but not limited to, light emitting diodes (LEDs).

Description

[0001] Cross references to related patent applications [0002] This application claims priority to US Provisional Patent Application Serial No. 61 / 420,925, filed December 8, 2010, which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates generally to methods for modifying metal oxide nanoparticles, and more particularly to methods for surface-treating metal oxide nanoparticles. Background technique [0004] Light emitting diodes (LEDs) are well known in the art and generally include one or more diodes (that emit light when excited) encapsulated (ie, enclosed) in an encapsulating material. LED designs using flip-chip or wire-bond chips are connected to diodes to provide power to the diodes. When a wire bond is present, a portion of the wire bond is at least partially encapsulated with the diode. When the LED is excited and emits light, there will be a rapid rise in temperature, subjecting the encapsulation material to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09C1/36C09C3/12H01L23/28
CPCC09C1/3676C01P2002/82C09C1/3684H01L23/296C09C1/00C01P2004/64C01P2004/51C09C3/12C01P2002/86B82Y30/00H01L2924/0002H01L2924/00B82B3/00H01L23/28
Inventor 尼子雅明伊藤真树须藤通孝
Owner DOW CORNING TORAY CO LTD
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