TGBAPOPP type matrix resin used for preparing advanced composite and preparation method of TGBAPOPP type matrix resin

An advanced composite material and matrix resin technology, applied in the field of polymer materials and its preparation, can solve the problems of high cost of polyetherimide resin, unfavorable large-scale popularization and application, small linear expansion coefficient, etc., and achieve good comprehensive performance, The effect of low cost and convenient operation

Inactive Publication Date: 2013-11-27
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] (7) Low thermal conductivity and small linear expansion coefficient, the thermal stress generated when there is a temperature difference is much lower than that of metal;
[0024] Monomers such as 2,2-bis(3-amino-4-hydro

Method used

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  • TGBAPOPP type matrix resin used for preparing advanced composite and preparation method of TGBAPOPP type matrix resin
  • TGBAPOPP type matrix resin used for preparing advanced composite and preparation method of TGBAPOPP type matrix resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] 1000 grams of N,N,N',N'-tetraglycidyl-2,2-bis[4-(4-aminophenoxy)phenyl]propane (TGBAPOPP), 500 grams of o-cresol novolac epoxy resin , 150 grams of 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane was put into the reaction kettle, and after reacting at 90°C for 1 hour, 1000 grams of N-iso Propyl-N'-phenyl-p-phenylenediamine solution (20 g N-isopropyl-N'-phenyl-p-phenylenediamine, 250 g dichloromethane and 730 g acetone), 1100 g 2,2,4 - Trimethyl-1,2-dihydroquinoline solution (50 grams of 2,2,4-trimethyl-1,2-dihydroquinoline and 1050 grams of acetone), stir and mix well, add 3900 grams of curing agent Solution (830 g 4,4'-bis(4-aminophenoxy)diphenylsulfone, 100 g 2,4,6-tris(dimethylaminomethyl)phenol and 2970 g N-methyl-2-pyrrolidone ), stirred and mixed evenly to obtain 7650 grams of TGBAPOPP matrix resin for advanced composite materials, denoted as MTGB-1.

Embodiment 2

[0040] 1000 grams of N,N,N',N'-tetraglycidyl-2,2-bis[4-(4-aminophenoxy)phenyl]propane (TGBAPOPP), 800 grams of o-cresol novolac epoxy resin , 100 grams of 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane was put into the reaction kettle, and after reacting at 100°C for 0.5 hours, 1100 grams of N-iso Propyl-N'-phenyl-p-phenylenediamine solution (50 g of N-isopropyl-N'-phenyl-p-phenylenediamine and 1050 g of acetone), 1100 g of 2,2,4-trimethyl-1 , 2-dihydroquinoline solution (20 grams of 2,2,4-trimethyl-1,2-dihydroquinoline and 1080 grams of acetone), stir and mix well, add 5500 grams of curing agent solution (200 grams of 2, 2-bis[4-(4-aminophenoxy)phenyl]propane, 200 grams of 3,4'-diaminodiphenyl ether, 100 grams of p-phenylenediamine, 130 grams of 2,4,6-tris(di Methylaminomethyl) phenol and 3070 gram N-methyl-2-pyrrolidone, 1800 gram dichloromethane), stir and mix uniformly, obtain 9600 gram advanced composite material TGBAPOPP type matrix resin, denote as MTGB-2.

Embodiment 3

[0042] 1000 grams of N,N,N',N'-tetraglycidyl-2,2-bis[4-(4-aminophenoxy)phenyl]propane (TGBAPOPP), 1000 grams of o-cresol novolac epoxy resin , 300 grams of 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane was put into the reactor, and after reacting at 100°C for 1 hour, 1300 grams of N-iso Propyl-N'-phenyl-p-phenylenediamine solution (50 g N-isopropyl-N'-phenyl-p-phenylenediamine and 1250 g acetone), 1400 g 2,2,4-trimethyl-1 , 2-dihydroquinoline solution (50 grams of 2,2,4-trimethyl-1,2-dihydroquinoline and 1350 grams of acetone), stir and mix well, add 6000 grams of curing agent solution (150 grams of 2, 2-bis[4-(4-aminophenoxy)phenyl]propane, 250 g 1,3-bis(3-aminophenoxy)benzene, 300 g 3,3'-dimethyl-4,4 '-Diaminodiphenylmethane, 180 g 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, 120 g 2,4,6-tris(dimethylaminomethyl)phenol and 3,000 grams of N-methyl-2-pyrrolidone, 2,000 grams of N,N-dimethylformamide), and stir and mix evenly to obtain 11,000 grams of TGBAPOPP matrix re...

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Abstract

The invention relates to TGBAPOPP type matrix resin used for preparing an advanced composite and a preparation method of the TGBAPOPP type matrix resin. The TGBAPOPP type matrix resin comprises N, N, N', N'-quadriglycidyl-2, 2-double[4-(4-amidogenphenoxy) phenyl]dimethylmethane, o-cresol-formaldehyde epoxy resin, 2, 2-double[4-(4-maleimidephenoxy) phenyl]dimethylmethane, N-isopropyl-N'-phenyl ursol, 2, 2, 4-trimethyl-1, 2-di-hydrogenationquinoline, curing agent and organic curing agent, wherein the mass ratio of all the components is 100: (50-100): (10-30): (2-5): (2-5): (60-100) : (500-900). The TGBAPOPP type matrix resin, disclosed by the invention, has excellent overall performance and excellent wettability to glass fiber, carbon fiber, basalt fiber and aramid fiber, can be used for preparing advanced composites with excellent overall performance, and has a broad application prospect.

Description

technical field [0001] The invention belongs to the field of polymer materials and preparation thereof, in particular to a TGBAPOPP matrix resin for advanced composite materials and a preparation method thereof. Background technique [0002] With the rapid development of high-tech fields such as aerospace, electronics, microelectronics, motors, electrical appliances, automobiles, high-speed trains, ships and submarines, the demand for advanced composite materials is increasing day by day, and their performance requirements are also getting higher and higher. Therefore, the development of high-performance advanced composite materials has become one of the main development directions in the field of new materials today, and has been highly valued by countries all over the world. [0003] Composite materials are mainly composed of two parts, namely matrix and reinforcement materials. According to different matrix materials, composite materials can be divided into three categor...

Claims

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Application Information

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IPC IPC(8): C08G59/62C08G59/40C08G59/56C08G59/32C08G59/20
Inventor 虞鑫海虞静远陈东红
Owner DONGHUA UNIV
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