Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Novel dedicated PCB aluminum-based foil produced by aluminum scraps and preparation process of novel dedicated PCB aluminum-based foil

A preparation process, a technology of aluminum waste, applied in the field of special PCB aluminum-based foil material and preparation, to achieve the effect of no scratches, good high temperature resistance and stable quality

Active Publication Date: 2015-07-15
江阴新仁铝箔科技有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the continuous update of the demand for PCB aluminum substrates, the requirements for its performance are also getting higher and higher, and the existing advantages have gradually failed to meet the needs of technological updates. It is easier to weld, higher strength, and high temperature resistance. PCB aluminum substrate (foil) materials with better, stronger corrosion resistance, better heat dissipation, and higher cost performance have become the subject of research by people in this field.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] A special PCB aluminum-based foil produced from mixed aluminum waste materials. The chemical composition mass percentage of the PCB aluminum-based special foil is: Fe: 0.49~0.65%, Si: 0.36~0.49%, Ce: 0.10~0.15% , Gd: 0.05~0.10%, Mn: <0.25%, Zn: <0.15%, Ti: <0.05%, Cu: <0.045%, Mg: <0.045%, the balance is Al.

[0047] The mass ratio of Fe to Si is between 1.12 and 1.35.

[0048] The preparation process of a special PCB aluminum-based foil material produced with aluminum mixed waste, the process includes the following steps:

[0049] S1: Furnace preparation → charge preparation → furnace installation → melting → stirring and slagging → adjusting composition → first refining in the furnace → converter and standing → second refining → degassing box degassing slagging → filter box dual channel Two-stage ceramic filter plate to filter and remove slag→cast-rolled into 8mm thick cast-rolled coil;

[0050] S2: Roll the cast-rolled coil, first cold-roll the cast-rolled coil to a thickne...

Embodiment 2

[0061] A special PCB aluminum-based foil material produced with aluminum mixed waste in the middle, the chemical composition mass percentage of the PCB aluminum-based special foil material is: Fe: 0.49~0.65%, Si: 0.36~0.49%, Ce: 0.10~0.15 %, Gd: 0.05~0.10%, Mn: <0.25%, Zn: <0.15%, Ti: <0.05%, Cu: <0.045%, Mg: <0.045%, the balance is Al.

[0062] The mass ratio of Fe to Si is between 1.12 and 1.35.

[0063] The preparation process of a special PCB aluminum-based foil material produced with aluminum mixed waste, the process includes the following steps:

[0064] S1: Furnace preparation → charge preparation → furnace installation → melting → stirring and slagging → adjusting composition → first refining in the furnace → converter and standing → second refining → degassing box degassing slagging → filter box dual channel Two-stage ceramic filter plate to filter and remove slag→cast-rolled into 8mm thick cast-rolled coil;

[0065] S2: Roll the cast-rolled coil, first cold-roll the cast-ro...

Embodiment 3

[0075] A special PCB aluminum-based foil produced from mixed aluminum waste materials. The chemical composition mass percentage of the PCB aluminum-based special foil is: Fe: 0.49~0.65%, Si: 0.36~0.49%, Ce: 0.10~0.15% , Gd: 0.05~0.10%, Mn: <0.25%, Zn: <0.15%, Ti: <0.05%, Cu: <0.045%, Mg: <0.045%, the balance is Al.

[0076] The mass ratio of Fe to Si is between 1.12 and 1.35.

[0077] The preparation process of a special PCB aluminum-based foil material produced with aluminum mixed waste, the process includes the following steps:

[0078] S1: Furnace preparation → charge preparation → furnace installation → melting → stirring and slagging → adjusting composition → first refining in the furnace → converter and standing → second refining → degassing box degassing slagging → filter box dual channel Two-stage ceramic filter plate to filter and remove slag→cast-rolled into 8mm thick cast-rolled coil;

[0079] S2: Roll the cast-rolled coil, first cold-roll the cast-rolled coil to a thickne...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
tensile strengthaaaaaaaaaa
tensile strengthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a dedicated PCB aluminum-based foil produced by aluminum scraps and a preparation process of the novel dedicated PCB aluminum-based foil. The foil comprises the main following chemical components by weight: 0.49-0.65% of Fe, 0.36-0.49% of Si, 0.10-0.15% of Ce, 0.05-0.10% of Gd and the like. The foil has higher surface cleanliness, and is uniform in color, high in mechanical property, high in thermal conductivity, suitable for machining such as punching, shearing and cutting, and more suitable for the surface mount technology of power components; the technological process of the dedicated PCB aluminum-based foil solves the problem that the waste scraps in the production field are not recycled to the most extent, improves the production environment, shortens the waste scraps storage time, improves the production and management environment, reduces the production cost, and improves the economic benefits.

Description

technical field [0001] The invention belongs to the technical field of aluminum foil processing, and in particular relates to a special PCB aluminum-based foil material produced from aluminum waste and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, the size and volume of electronic products are getting smaller and smaller, and the power density is getting higher and higher. Solving the problem of heat dissipation is constantly being raised to new heights, which is a huge challenge for the design of the electronics industry. The emergence of printed circuit board (PCB) aluminum substrate is undoubtedly one of the effective means to solve this problem. PCB aluminum substrate is a unique aluminum-based copper clad laminate, which has good thermal conductivity, electrical insulation and machinability. PCB aluminum-based copper-clad laminate is a metal circuit board. The material is composed of a conductive lay...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C22C21/00C22C1/03
Inventor 黄善球白杰朱东年范文慧王民生刘应安申喜美
Owner 江阴新仁铝箔科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products