Silicon wafer fully-automatic feeding/discharging manipulator and movement trajectory control method thereof

Abstract

The invention discloses a silicon wafer fully-automatic feeding/discharging manipulator and a movement trajectory control method thereof. The silicon wafer fully-automatic feeding/discharging manipulator and the movement trajectory control method thereof are used for fully-automatic feeding/discharging in multi-channel chain-type texturing, chain-type cleaning and sintering devices. The manipulator of the invention comprises a mounting base, a shoulder joint, a big arm, a small arm and a gripper used for gripping silicon wafers to multichannel solar battery sheet process equipment; the swing of the big arm and the small arm is controlled through a motor, and parametric design and PID control are adopted to realize concise control of the movement trajectory of the manipulator. With the silicon wafer fully-automatic feeding/discharging manipulator and the movement trajectory control method thereof of the invention adopted, problems such as large occupied space, complex mechanism, low flexibility, slow response and high production cost of chain-type texturing, chain-type cleaning and sintering devices as well as problems of serious wear of silicon wafer surface, low conversion efficiency and high fragmentation rate can be solved.

Description

technical field [0001] The invention relates to the field of solar photovoltaic equipment, in particular to a fully automatic loading and unloading manipulator for silicon wafers and a motion trajectory control method thereof, which are used for fully automatic loading and unloading of silicon wafers in chain texturing, chain cleaning and sintering equipment. Background technique [0002] The loading and unloading methods of multi-channel solar cell process equipment such as chain texturing, chain cleaning and sintering equipment are mostly completed by belt transmission. This equipment takes up a lot of space, has complex mechanisms, low flexibility, slow response, and high production costs. , and the surface of the silicon wafer is greatly worn during the transmission process, which reduces the conversion efficiency of the solar cell and causes a large number of debris, which increases the production cost. Contents of the invention [0003] The technical problem to be so...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a fully automatic loading and unloading manipulator for silicon wafers and its motion track control method in view of the deficiencies of the existing technologies, so as to solve the problem that the loading and unloading systems of chain texturing, chain cleaning and sintering equipment take up a lot of space ,...

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