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A kind of manufacturing method of low dielectric constant cem-3 copper clad laminate
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A low dielectric constant and manufacturing method technology, applied in the field of copper clad laminate manufacturing, can solve problems such as complex process, high melt viscosity, and environmental pollution
Active Publication Date: 2016-04-13
SHAANXI SHENGYI TECH
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[0002] The current low dielectric constant copper clad laminates are generally made of polytetrafluoroethylene resin, cyanate resin, polyphenylene ether resin or polyimide resin. Although they have excellent dielectric properties, they also have certain Disadvantages: PTFE resin has high melt viscosity (10 10 Pa.s / 380°C), PTFE-based copper-clad laminates need to be pressed and formed at a high temperature of 380--400°C, the process is complicated, and toluene is used in the production process of polyphenylene ether resin-based copper-clad laminates, which pollutes the environment. There is also the problem of high melt viscosity, the cost of cyanate-based copper-clad laminates is too high, and the cost of polyimide resin-based copper-clad laminates is high and the process is complicated
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Embodiment 1
[0020] A method for manufacturing a low dielectric constant CEM-3 copper clad laminate, comprising the following steps:
[0022] 1.1 Dissolve 100 parts of epoxy resin with 40 parts of the first solvent to make an epoxy resin solution. The epoxy resin is bisphenol A epoxy (E-20), and the first solvent is acetone.
[0023] 1.2 Dissolve 5 parts of the curing agent with 10 parts of the second solvent to make a curing agent solution. The curing agent is 2-methyl-imidazole, and the second solvent is butanone.
[0024] 1.3 3 parts of hydroxyl inactivator, the hydroxyl inactivator is active silicone,
[0025] 1.4 Stir the epoxy resin solution, curing agent solution, and hydroxyl inactivator evenly to make an epoxy resin liquid, stir evenly, and wait for 8 hours of aging;
[0026] 2. Surface treatment of composite filler: mix 200 parts of low dielectric filler, 150 parts of third solvent, and 4 parts of surface treatment agent at 40°C ...
Embodiment 2
[0033] A method for manufacturing a low dielectric constant CEM-3 copper clad laminate, comprising the following steps:
[0034] 1. Preparation of epoxy resin solution:
[0035] 1.1 Dissolve 100 parts of bisphenol A epoxy (E-20) and 20 parts of bisphenol A epoxy resin (E-51) in 40 parts of the first solvent to make an epoxy resin solution. The first solvent is acetone,
[0036] 1.2 Dissolve 1.2 parts of curing agent with 20 parts of the second solvent to make a curing agent solution. The curing agent is dicyandiamide, and the second solvent is DMF.
[0037] 1.3 30 parts of hydroxyl inactivator, the hydroxyl inactivator is active silicone,
[0038] 1.4 Stir the epoxy resin solution, curing agent solution, and hydroxyl deactivator evenly to make epoxy resin liquid;
[0039] 2. Surface treatment of composite filler: 240 parts of low dielectric filler, 150 parts of the third solvent, 4 parts of surface treatment agent, mixed and stirred at 40 ° C for 2 hours,
[0040] The low ...
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Abstract
A method for manufacturing low dielectric constant CEM-3 copper-clad laminates, firstly prepare epoxy resin liquid, then perform surface treatment of composite filler, then prepare composite resin liquid, then prepare bonding sheet, and finally carry out For the pressing of laminated boards, the epoxy resin composition of the present invention has a low dielectric constant due to the selection of a special curing agent and a hydroxyl deactivator, so that the cured resin does not contain or only contains a small amount of secondary hydroxyl groups, and has a low dielectric constant. Inorganic fillers with low dielectric constants are introduced, so CEM-3 copper clad laminates with a series of different dielectric constants from 3.2 to 3.9 can be obtained.
Description
technical field [0001] The invention relates to the technical field of manufacturing copper clad laminates, in particular to a method for manufacturing low dielectric constant CEM-3 copper clad laminates. Background technique [0002] The current low dielectric constant copper clad laminates are generally made of polytetrafluoroethylene resin, cyanate resin, polyphenylene ether resin or polyimide resin. Although they have excellent dielectric properties, they also have certain Disadvantages: PTFE resin has high melt viscosity (10 10 Pa.s / 380°C), PTFE-based copper-clad laminates need to be pressed and formed at a high temperature of 380--400°C, the process is complicated, and toluene is used in the production process of polyphenylene ether resin-based copper-clad laminates, which pollutes the environment. There is also the problem of high melt viscosity, the cost of cyanate-based copper-clad laminates is too high, and the cost of polyimide resin-based copper-clad laminates i...
Claims
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