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Preparation method of diamond composite coating of micro milling cutter

A composite coating, diamond technology, applied in metal material coating process, coating, gaseous chemical plating and other directions, to achieve the effect of delaying cracks, reducing processing costs, and improving smoothness

Active Publication Date: 2013-12-11
XIAMEN GOLDEN EGRET SPECIAL ALLOY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide the inner layer of the formed diamond composite coating as a wear-resistant submicrocrystalline coating, and to overcome the difficulties in processing difficult-to-machine materials and the deficiencies of existing complex-shaped diamond-coated tools. The coating layer of the diamond composite coated PCB micro milling cutter for difficult-to-machine materials is a fine nanocrystalline coating, so that the diamond composite coated PCB micro milling cutter has better processing performance and a longer processing life. Preparation method of diamond composite coating for milling cutter

Method used

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  • Preparation method of diamond composite coating of micro milling cutter
  • Preparation method of diamond composite coating of micro milling cutter

Examples

Experimental program
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Effect test

Embodiment 1

[0029] see figure 1 , using diamond coating equipment for production, the preparation includes the following steps:

[0030] Step a. Load the PCB micro milling cutter 1 into the tooling 2;

[0031] Step b. Install the tooling 2 equipped with the micro milling cutter 1 into the deposition reaction chamber 3;

[0032] Step c. The deposition reaction chamber 3 is evacuated to a vacuum state with a vacuum pump 4;

[0033] step d. Methane (CH 4 ), hydrogen (H 2 ) and oxygen (O 2 ) 3 kinds of gases; among them, the volume ratio of methane, hydrogen and oxygen is (0.1%~10%): (90%~99.99%): (0%~5%);

[0034] Step e. A direct current arc is passed from the power supply 5 to the heating wire installed in the deposition reaction chamber 3; wherein, the heating wire is a tungsten wire or a tantalum wire; the temperature of the heating wire is 2000-2100°C; the applied arc current is 180A;

[0035] step f. In the deposition reaction chamber 3, the deposition process is divided in...

Embodiment 2

[0040] The preparation method of the diamond composite coating of a kind of PCB micro milling cutter of the present invention is similar to embodiment 1, and its difference is:

[0041] step d. Methane CH is introduced into the deposition reaction chamber 4 , hydrogen H 2 and oxygen O 2 Three kinds of gases; among them, the volume ratio of methane, hydrogen and oxygen is (0.1%~10%): (90%~99.99%): (0~6%);

[0042] Step e. Introduce a DC arc to the tungsten wire installed in the deposition reaction chamber; where the temperature of the heating wire is 2100-2200 ° C; the applied arc current is 185A;

[0043] step f. In the deposition reaction chamber, the deposition process is divided into five stages: heating period, nucleation period, submicrocrystalline growth period, ultrafine nanocrystal growth period, and end-of-growth period. The five stages adopt different vapor deposition conditions. The phase and ultrafine nanocrystal growth period can occur cyclically, and the nu...

Embodiment 3

[0048] The preparation method of the diamond composite coating of a kind of PCB micro milling cutter of the present invention is similar to embodiment 1, and its difference is:

[0049] step d. Methane CH is introduced into the deposition reaction chamber 4 , hydrogen H 2 and oxygen O 2 Three kinds of gases; among them, the volume ratio of methane, hydrogen and oxygen is (0.1%~10%): (90%~99.99%): (0~7%);

[0050] Step e. Introduce a direct current arc to the tungsten wire installed in the deposition reaction chamber; among them, the temperature of the heating tungsten wire is 2300°C; the applied arc current is 190A;

[0051] step f. In the deposition reaction chamber, the deposition process is divided into five stages: heating period, nucleation period, submicrocrystalline growth period, ultrafine nanocrystal growth period, and end-growth period. The five stages adopt different atmospheric deposition conditions, and the submicrocrystalline growth The phase and ultrafine ...

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Abstract

The invention discloses a preparation method of a diamond composite coating of a micro milling cutter, and relates to the micro milling cutter. The preparation method comprises the following steps of: placing a PCB (Printed Circuit Board) micro milling cutter into a tool and then placing into a deposition reaction chamber; evacuating the deposition reaction chamber, and introducing methane (CH4), hydrogen gas and oxygen gas into the deposition reaction chamber; applying direct-current electric arc to a heating wire which is installed in the deposition reaction chamber, wherein a deposition process in the deposition reaction chamber is divided into five stages including a heating stage, a nucleation stage, a submicrocrystal growth stage, a superfine nanocrystalline growth stage and a final growth stage, different gas-phase deposition conditions are adopted in the five stages, the submicrocrystal growth stage and the superfine nanocrystalline growth stage can be generated in a circulating manner to form a diamond submicrocrystal and superfine nanocrystalline composite coating, and the circulating generation number is N (N is not less than 1). The prepared diamond composite coating of the micro milling cutter can be used for keeping the cutting edge to be sharp for a longer time, obviously improving the machining effect, prolonging the service life of the cutter, reducing the cutter changing frequency, improving the machining efficiency and lowering the machining cost.

Description

technical field [0001] The invention relates to a micro milling cutter, in particular to a method for preparing a diamond composite coating of a micro milling cutter mainly used for printed circuit boards. Background technique [0002] A printed circuit board (PCB, Printed Circuit Board) is a circuit product made by printing or image transfer technology. In all kinds of products in modern society, ranging from computers and televisions to mobile phones and IC cards, as long as there are circuits in the products, there are printed circuit boards. With the implementation of EU RoHS (Restriction on the use of certain hazardous substances in electrical and electronic equipment), environmental protection PCB boards have undergone tremendous changes under the requirements of RoHS. The global PCB industry has entered the era of lead-free compatibility and halogen-free environmental protection, but in order to ensure dimensional stability, oxide fillers such as aluminum, barium, si...

Claims

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Application Information

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IPC IPC(8): C23C16/27C23C16/52
Inventor 卢志红陈亚奋张守全魏祥源
Owner XIAMEN GOLDEN EGRET SPECIAL ALLOY
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