A surface treatment method that can control the carrier concentration of carbon-based semiconductor devices
A carrier concentration and surface treatment technology, applied in the field of nanoelectronics, can solve the problems of large structural damage of carbon materials and decreased carrier mobility of materials
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Embodiment 1
[0034] Embodiment 1: use CVD to grow graphene material, on the silicon dioxide / silicon substrate after n-propyltrimethoxysilane is processed film formation, realize graphene field effect transistor.
[0035] figure 2 Use silane coupling agent to carry out the flowchart of surface treatment to substrate for the embodiment of the present invention, comprise the following steps:
[0036] Step 1: After diluting the silane coupling agent with a solvent, immerse the substrate in the diluted solution. Before immersing, the substrate material needs to be cleaned and baked and dried;
[0037] In this embodiment, the silane coupling agent-n-propyltrimethoxysilane dilution is prepared, and n-propyltrimethoxysilane (purchased from China Pharmaceutical Group Chemical Reagent Beijing Co., Ltd.) and absolute ethanol solution are mixed in volume ratio 1:20-1:400 for dilution, shake well after dilution, immerse the substrate in the silane dilution solution for 1-20 minutes; then put the clea...
Embodiment 2
[0042] Embodiment 2: use CVD to grow graphene material, on the silicon dioxide / silicon substrate after processing film formation through aminopropyltrimethoxysilane, realize graphene field effect transistor.
[0043] The specific steps are similar to Example 1, but in step 1, the dilute solution is prepared with aminopropyltrimethoxysilane and absolute ethanol at a ratio of 1:20-1:400, and the substrate is immersed in the silane diluent for 1-20 minutes . After step 3, measure the thickness of the aminopropyltrimethoxysilane organic film layer to be 1nm-20nm.
Embodiment 3
[0044] Embodiment 3: use CVD growth graphene material, on the silicon dioxide / silicon substrate after (3-oxiranyl methoxy propyl) trimethoxysilane process film formation, realize graphene field effect transistor .
[0045] The specific steps are similar to Example 1, but in step 1, use (3-oxiranylmethoxypropyl) trimethoxysilane and isopropanol to dilute with a volume ratio of 1:20-1:400, and the substrate Wetting deposition time is 1-20 minutes. After step 3, measure the thickness of the (3-oxiranylmethoxypropyl)trimethoxysilane organic film layer to be 1nm-20nm.
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