Method for utilizing high-pressure hot air to automatically separate waste circuit board elements

Abstract

The invention relates to a method for utilizing high-pressure hot air to automatically separate waste circuit board elements. The method includes using a screw structure to fix to-be-separated circuit boards on a conveying belt for conveying, and using high-pressure high-temperature air flow impact to separate substrates and the elements of the circuit boards, wherein high-pressure high-temperature air flows are blown out in a way like air knives or air knife slotting openings to remove soldering flux and force the elements to fall off. By the method, industrial application of the automatic waste circuit board element separation, harmless treatment is performed on toxic and harmful gases, the circuit boards are treated efficiently, a large amount of valuable elements are recycled losslessly, and recycling is possible.

Description

Technical field [0001] The invention relates to a method for automatically separating waste gas circuit board components by using high-pressure hot air, and belongs to the technical field of comprehensive utilization of electronic waste resources. Background technique [0002] In recent years, the electronic waste generated by household appliances has reached a peak period of obsolescence, and used TV sets account for a considerable proportion of the electronic waste. According to incomplete statistics, the annual scrap volume of TV sets is 23,750,200 (2010), 2548.04. Ten thousand units (2011), 277291 million units (2012). Among them, the circuit board is an important part of the discarded TV. It is usually formed by welding an insulating substrate coated with copper foil on one or both sides and several components through low temperature soldering. The substrates are mostly flame-retardant phenolic paper-based copper-clad laminates, non-flame-retardant phenolic paper-based copp...

AI Technical Summary

Problems solved by technology

[0014] When the circuit board is heated at 270°C to 350°C, a severe thermal decomposition weight loss reaction will occur, and the flame retardant (mainly bromine-containing epoxy resin) in the circuit board will be partially decomposed. In addition, during the manufacturing process of the circuit board, Adding organic substances such as curing agents and accelerators, these organic substances will volatilize or decompose when heated, and most of the organic pollutants produced have odor and strong toxicity at low concentrations, which are harmful to the working environment and human health.

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