Production process of super-thin touch screen

A production process and touch screen technology, applied in the field of ultra-thin touch screen production process, can solve the problems of complex structure, numerous processes, heavy weight, etc., and achieve the effect of reduced process, simple and cheap process, and lighter and thinner structure.

Active Publication Date: 2014-01-01
广东金龙机电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen from the above that the current commonly used capacitive touch screen structure has the problems of large thickness, relatively large weight, complex structure and various processes caused by it.

Method used

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  • Production process of super-thin touch screen
  • Production process of super-thin touch screen
  • Production process of super-thin touch screen

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Embodiment Construction

[0018] In order for those skilled in the art to better understand the technical solutions provided by the present invention, the following will be described in conjunction with specific embodiments.

[0019] See figure 1 , which is a flow chart of the production process of the ultra-thin touch screen in the embodiment of the present invention.

[0020] The production process of the ultra-thin touch screen provided by the embodiment of the present invention includes the following steps:

[0021] (1) Ultrasonic cleaning of the strengthened substrate coated with a conductive film layer in an ultrasonic cleaning machine;

[0022] (2) Use a laser cutting machine or printing machine to perform laser laser or dry etching on the substrate, and then perform functional testing;

[0023] (3) The functionally qualified substrate needs to be printed with two layers of ink first, namely: color insulating ink layer, color conductive ink layer; then print the conductive circuit layer; final...

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Abstract

The invention provides a production process of a super-thin touch screen. The production process includes the following steps that (1) ultrasonic cleaning is carried out on a substrate which is reinforced and plated with a conductive membrane layer in an ultrasonic washing unit; (2) the substrate undergoes laser or dry-etching operation through a laser cutting machine or a printer; (3) two layer of printing ink, including a colored insulating printing ink layer and a colored conductive printing ink layer, are printed on the substrate which is qualified in function; (4) a flexible circuit board and the printed substrate are pre-pressed through a pre-pressing machine so as to be basically connected, then bonding pressing operations are carried out on the flexible circuit board and the printed substrate through a main-bonder cog so that the flexible circuit and the printed substrate are connected; (5) an anti-explosion membrane is attached to the product, and a bubble removing machine is used so that bubbles can be removed after the anti-explosion membrane is attached. Compared with the prior art, the layers of the touch screen can be reduced, the structure is lighter and thinner, the process is simple and low in price, materials are reduced, loss and pollution are lower, working procedures are reduced, and labor cost is reduced.

Description

technical field [0001] The invention relates to the field of touch screens, in particular to a production process of ultra-thin touch screens. Background technique [0002] The touch screen is a device that converts the sensing signal into a digital signal to realize human-computer interaction; among them, the capacitive touch screen is the capacitance change generated between the finger or the conductive medium and the electrode on the substrate when touching, through the digital signal of the driving chip. Convert and output the coordinate position of finger or conductive medium touch. At present, capacitive touch screens have been widely used in mobile phones, tablets and other fields. At present, the capacitive touch screen traditionally used is generally a structure in which two layers of glass are bonded by optical glue; or a structure in which one layer of glass and two or three layers of sensor film are bonded by optical glue. It can be seen from the above that the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/044
Inventor 金绍平晁雷雷胡文波郑晓刘维宠张兵龙项超群李祺
Owner 广东金龙机电有限公司
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