Method for conducting magneto-rheological thinning and polishing on InP-based RFIC wafer
A thinning polishing and magnetorheological technology, applied in the field of InP RFIC preparation, can solve problems such as physical damage of InP substrate extrusion stress, and achieve the effects of avoiding distortion of machining accuracy, good elasticity and fast speed
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[0020] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following further describes the present invention in detail in conjunction with specific embodiments and with reference to the accompanying drawings.
[0021] Such as figure 1 As shown, figure 1 It is a flow chart of a method for magnetic rheological thinning and polishing of InP-based RFIC wafers according to an embodiment of the present invention. The method includes the following steps:
[0022] Step 1: Bond the InP-based RFIC wafer to the UV film:
[0023] In this step, the InP-based RFIC wafer to be thinned is placed on the UV mucosa, placed on the hot plate, the temperature of the hot plate is 60℃, and the temperature is 2×10 -2 Under mabr vacuum, apply 0.6bar pressure on the InP-based RFIC wafer for bonding, and the bonding time is 20 minutes.
[0024] Step 2: Immerse the side of the InP-based RFIC wafer that needs to be polished into the oil-based polishing solution...
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