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A kind of thermosetting resin composition and its application

A resin composition, thermosetting technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problems of complex operation and inability to improve the adhesion between laminate layers and layers, and achieve simple operation , increase storage stability, enhance the effect of adhesion

Inactive Publication Date: 2016-02-17
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, some people use resin-coated copper foil for lamination to enhance its adhesion, but this method is complicated to operate and cannot improve the adhesion between laminate layers

Method used

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  • A kind of thermosetting resin composition and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-8

[0037] Brominated bisphenol A epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530), dicyandiamide, 2-methylimidazole, polyurethane micropowder, inorganic filler, dissolved in organic solvent , mechanically stirred, emulsified to prepare 65wt% glue, then impregnated with glass fiber cloth, heated and dried to form a prepreg (prepreg), placed copper foil on both sides, pressurized and heated to form a copper foil substrate.

[0038] Using the obtained copper-clad laminate, the coefficient of thermal expansion, interlayer adhesion, and dispersibility effects were evaluated by the method shown below, and the results are shown in Tables 1 and 2.

[0039] A) Polyurethane micropowder:

[0040] A-1 polyurethane micropowder, Dongguan Sanhe Chemical Co., Ltd., MP750, average particle size 2μm, ratio of short diameter to long diameter is 1:1~1:1.1;

[0041] A-2 polyurethane micropowder, Shanghai Yangli Electromechanical Technology Co., Ltd., the ave...

Embodiment 9-16

[0074] 100 parts by weight of brominated bisphenol A epoxy resin (Dow Chemical, epoxy equivalent 435, bromine content 19%, product name DER530), 24 parts by weight novolak resin (Japan Qunrong, hydroxyl equivalent 105, product name TD2090), 0.05 parts by weight of 2-methylimidazole, polyurethane micropowder, inorganic filler, dissolved in an organic solvent, mechanically stirred and emulsified to prepare a 65wt% glue, then impregnated with glass fiber cloth, heated and dried to form a prepreg (prepreg ), place copper foil on both sides, pressurize and heat to make a copper foil substrate.

[0075] Using the obtained copper-clad laminate, the coefficient of thermal expansion, interlayer adhesion, and dispersion effects were evaluated by the method described above. The results are shown in Tables 3 and 4.

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Abstract

The invention discloses a thermosetting resin composition. The composition comprises 20-90 wt% of thermosetting resin, 1-30 wt% of a curing agent, 0-10 wt% of an accelerant, polyurethane micro-powder and organic filler, wherein the composition can be prepared into a prepreg in an impregnating manner or prepared into a coated object in a coating manner. The composition is capable of remarkably improving a bonding interface between the resin and the organic filler, the interlayer adhesiveness of a laminated board, and the adhesiveness between the resin and a copper foil.

Description

technical field [0001] The invention relates to a thermosetting resin composition and its application, in particular to a thermosetting resin composition and resin glue, prepreg, laminate and printed circuit board obtained from the thermosetting resin. Background technique [0002] With the rapid development of electronic products towards miniaturization, multi-function, high performance and high reliability, printed circuit boards begin to move towards high precision, high density, high performance, microporous, thin and multilayer The direction is developing rapidly, and its application scope is becoming more and more extensive. It has rapidly entered civilian electrical appliances and related products from industrial large-scale electronic computers, communication instruments, electrical measurement, national defense, aviation, aerospace and other departments. The matrix material largely determines the performance of printed circuit boards, so it is urgent to develop a ne...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/02C08L61/06C08L75/04C08L75/06C08L75/08C08K9/10C08K3/36C08K3/34B32B27/04B32B15/092B32B15/098H05K1/03
Inventor 杜翠鸣
Owner GUANGDONG SHENGYI SCI TECH