Ceramic circuit board
A circuit substrate and circuit board technology, which is applied in the direction of circuits, ceramic products, electrical components, etc., can solve problems such as thermal stress and thermal load increase, and achieve the effects of high characteristics, cost reduction, and shortened sintering time
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Embodiment 1）
[0234] 0.1% by mass of Na is added as a sintering aid to high-purity alumina powder composed of α-alumina crystals with an average particle size of 1.5 μm (15% by mass of 0.8 μm or less) and a purity of 99.9%. 2 O, 0.2% by mass of SiO 2 , 0.05% by mass of Fe 2 o 3 , and then add an organic binder, and use a ball mill (using alumina balls with a purity of 96%) to prepare a mixed slurry of raw materials. The scraper method is used to form the mixed slurry of each raw material into a sheet to prepare a plate-shaped molded body. －4 It was completely degreased by heating at 800° C. for 8 hours in a Torr vacuum. The degreased body was sintered at a temperature of 1580° C. for 8 hours to prepare an alumina substrate of length 29 mm×width 69 mm×thickness 0.32 mm.
Embodiment 2～5）
[0256] Alumina substrates were prepared in the same manner as in Example 1 except that the amount of sintering aid and the sintering conditions were changed as shown in Table 1, and the same measurement as in Example 1 was performed. These results are shown in Tables 1-3.
[0257] The alumina substrate of this example exhibited excellent characteristics even if the sintering time was 10 hours or less.
Embodiment 1B～6B
[0258] (Examples 1B to 6B, Comparative Examples 1B to 3B)
[0259]Ceramic circuit boards were prepared using the alumina substrates and copper plates of Examples 1-5 and Comparative Examples 1-3. A copper plate in which a copper oxide film with a thickness of 4 μm was formed on the joint surface side by heat treatment was prepared. Copper plates (one copper plate for metal circuit boards and the other rear copper plate) were placed on both sides of the alumina substrate, and bonded by direct bonding by heating at 1075°C for 1 minute in a nitrogen atmosphere. In addition, the thickness of the copper plate for the metal circuit board is uniformly 0.3mm, and the thickness of the back copper plate is uniformly 0.4mm. Moreover, the carbon content in the copper plate prepared in Examples 1B-5B exists in the range of 0.2-0.8 mass %, and the copper plate prepared in Example 6B does not contain carbon.
[0260] Next, the metal circuit board of the obtained ceramic circuit board is et...
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