Preparation method and device achieving autocollimation of multilayer thin film microstructure

Abstract

The invention discloses a preparation method achieving autocollimation of a multilayer thin film microstructure. An inner cavity of a spray head is longitudinally divided into at least two chambers through a separating plate, and immiscible polymer solutions are injected into the chambers and are converged at the spray nozzle of the spray head. A high-voltage electrostatic field is applied, a receiving plate is driven to carry out plane linear motion, the solutions on the spray nozzle are deformed to be a taylor cone under the action of the high-voltage electrostatic field, jet flow is pulled out from the tip end of the taylor cone, the multiple types of the polymer materials in the jet flow carry out electrostatic spinning in the moving direction of the receiving plate, and the multilayer thin film microstructure is formed. The invention further discloses a device achieving the method. The separating plate is longitudinally arranged in the spray nozzle, the inner cavity of the spray nozzle is divided into at least a left chamber and a right chamber, an end portion covering plate is arranged on the end portion of the spray nozzle, a sealing fin is arranged between the end portion covering plate and the end portion of the spray nozzle, and a solution injecting hole is formed in the side face of the spray nozzle. The preparation method and the device achieving the autocollimation of the multilayer thin film microstructure achieve the high-precision autocollimation preparation of the multilayer thin film microstructure, and are simple in procedure, low in cost and beneficial to large-scale popularization and using.

Description

technical field [0001] The invention relates to the field of preparation of multilayer thin film microstructures, in particular to a preparation method and device capable of realizing self-alignment of multilayer thin film microstructures. Background technique [0002] Multilayer thin film microstructure is a thin film layered structure with multiple thicknesses in the micrometer or even nanometer scale, which widely exists in the field of electronic manufacturing. [0003] Currently common methods for preparing multilayer thin film microstructures include magnetron sputtering, vacuum coating, chemical vapor deposition, etc., and these preparation processes are all based on mask protective layers produced by photolithography. Generally, if a layer of patterned film is prepared on a silicon substrate, the following steps are required: first, the silicon substrate is cleaned, and a layer of photoresist is spin-coated on the surface, and dried; The film plate is photoetched un...

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Problems solved by technology

[0004] Flexible electronic devices usually have a multi-layer structure, and often encounter the overprinting problem of the double-layer structure. For example, the p-n junction of organic materials usually consists of two layers of free ions (electrons or holes) with different properties. On a flexible substrate Directly printing the p-n junction will encounter the alignment problem of the two thin layers. If the alignment cannot be completed, the p-n junction is likely to fail

At present, the manufacture of flexible electronic devices is usually realized based on the above-mentioned photolithography, coating and other processes. However, this preparation method requires complicated procedures and high costs, which is not conducive to large-scale promotion and use. Therefore, looking for A low-cost method that can realize the preparation of multilayer thin film microstructures for flexible electronic devices has become a hot topic in current research

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