Preparation method of epoxy composite material with low packing content, high thermal conductivity and ternary nano/micro structure

A composite material and epoxy technology, applied in the field of epoxy composite material preparation, can solve the problems of deteriorating mechanical and processing properties, high filler content of composite materials, weak thermal conductivity, etc., achieve excellent mechanical and processing properties, and reduce manufacturing costs. , the effect of a complete thermal network
CN103525005AActive Publication Date: 2014-01-22SHANGHAI JIAO TONG UNIV
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SHANGHAI JIAO TONG UNIV
Publication Date
2014-01-22

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Abstract

The invention relates to a preparation method of an epoxy composite material with low packing content, high thermal conductivity and a ternary nano / micro structure. The preparation method comprises the following steps of modifying through a silane coupling agent gamma-APS (Aminopropyltriethoxysilane), and introducing amino groups on the surfaces of Al2O3 and h-BN; grafting hyperbranched aromatic polyamide (HBP) on the surface of initially modified packing by taking grafted amino groups as an active site to obtain modified packing Al2O3-HBP and BN-HBP; sufficiently mixing the two kinds of modified packing and an epoxy resin matrix according to a certain proportion and content; preparing the epoxy composite material with the ternary nano / micro structure by using a two step-by-step heating and curing methods. The heat conducting property of the epoxy composite material provided by the invention has a remarkable synergistic effect, the heat conductivity coefficient of a system can be regulated through changing the proportion of the packing, the epoxy composite material has a high heat conductivity coefficient under low packing content, the favorable mechanical and processing performances of the composite material of a polymer are kept, and the cost is greatly reduced.
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Description

technical field

[0001] The invention relates to a preparation method of an epoxy composite material, in particular to a preparation method of a ternary nano-microstructure epoxy composite material with low filler content and high thermal conductivity. Background technique

[0002] With the rapid development of microelectronics integration and assembly technology, the volume of electronic components and logic circuits is getting smaller and smaller. At the same time, the operating frequency is increasing sharply, which causes the ambient temperature of semiconductors to change to high temperature. In order to ensure the long-term reliability of electronic components Work, timely heat dissipation ability becomes the restricting factor of its service life. In addition, many manufacturing and high-tech fields such as electrical appliances, LED lighting, aerospace, military equipment, etc. are also in urgent need of materials with excellent thermal conductivity. Polymer material...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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