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Conductive pattern and manufacturing method thereof

A manufacturing method and conductivity technology, which can be used in conductive pattern formation, printed circuit manufacturing, electrical components, etc., can solve problems such as disconnection, and achieve the effect of fine linearity.

Active Publication Date: 2016-09-07
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the plating chemical used in the above-mentioned plating process or the chemical used in its cleaning process is usually strongly alkaline or strongly acidic, so it will cause dissolution of the conductive pattern or its conductive ink receiving layer, etc., and its As a result, it sometimes causes disconnection etc.

Method used

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  • Conductive pattern and manufacturing method thereof
  • Conductive pattern and manufacturing method thereof
  • Conductive pattern and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0183] Example 1

[0184] 115 parts by mass of deionized water and 4 parts by mass of LATEMUL E-118B (manufactured by Kao Co., Ltd.: active ingredient 25% by mass) were added to a reaction container equipped with a stirrer, a reflux cooling tube, a nitrogen introduction tube, a thermometer, and a dropping funnel, The temperature was raised to 75°C while blowing nitrogen gas.

[0185] Under stirring, add 51 parts by mass of methyl methacrylate, 15 parts by mass of N-butoxymethacrylamide, 31 parts by mass of n-butyl acrylate, 2 parts by mass of acrylamide and methyl Vinyl monomer mixture of 1 mass part of acrylic acid, Aqualon KH-1025 (manufactured by Daiichi Kogyo Pharmaceutical Co., Ltd.: active ingredient 25 mass%) 4 mass parts and deionized water 15 mass parts mixed monomer pre-emulsion One part (5 parts by mass), and then 0.1 parts by mass of potassium persulfate were added, and polymerization was carried out for 60 minutes while maintaining the temperature in the reactio...

Embodiment 2～4

[0194] Examples 2 to 4

[0195] Except that the composition of the vinyl monomer mixture was changed to the composition described in the following Table 1, a resin combination for forming a receiving layer with a non-volatile content of 40% by mass was prepared by the same method as that described in Example 1. Objects (I-2) ~ (I-4).

[0196] In addition, the method described in Example 1 was used except that the above-mentioned resin compositions for receiving layer formation (I-2) to (I-4) were respectively used instead of the above-mentioned resin composition for forming a receiving layer (I-1). In the same way, the receiving substrates (II-2) to (II-4) were produced.

Embodiment 5

[0197] Example 5

[0198] 115 parts by mass of deionized water and 4 parts by mass of LATEMUL E-118B (manufactured by Kao Co., Ltd.: active ingredient 25% by mass) were added to a reaction container equipped with a stirrer, a reflux cooling tube, a nitrogen introduction tube, a thermometer, and a dropping funnel, The temperature was raised to 75°C while blowing nitrogen gas.

[0199] Under stirring, to the reaction container, add will comprise 57 parts by mass of methyl methacrylate, 35 parts by mass of butyl acrylate, 2 parts by mass of acrylamide, 1 part by mass of methacrylic acid, 5 parts by mass of 4-hydroxybutyl acrylate A part (5 parts by mass) of monomer pre-emulsion obtained by mixing 4 parts by mass of vinyl monomer mixture, Aqualon KH-1025 (manufactured by Daiichi Kogyo Pharmaceutical Co., Ltd.: active ingredient 25% by mass) and 15 parts by mass of deionized water ), and then 0.1 parts by mass of potassium persulfate was added, and polymerization was carried out ...

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Abstract

The present invention relates to a conductive pattern characterized in that it has a layer (A) including a support, a receiving layer (B) and a conductive layer (C), wherein the receiving layer (B) is formed by Formed by cross-linking the above-mentioned resin layer (B1) after coating the surface of the resin layer (B1) containing the vinyl resin (b1) with conductive ink containing the conductive substance (c) forming the conductive layer (C). , The above-mentioned vinyl resin (b1) is a resin obtained by polymerizing a monomer mixture containing 10% by mass to 70% by mass of methyl (meth)acrylate.

Description

technical field [0001] The present invention relates to a conductive pattern that can be used in electric circuits and its manufacturing method. Background technique [0002] In recent years, in the rapidly growing inkjet printing related industries, the high performance of inkjet printers and the improvement of ink have been greatly promoted, and even ordinary families can easily obtain high-definition and An image with excellent vivid printability. As a result, inkjet printers have not only been used at home, but have also been studied for use in the manufacture of large billboards and the like. [0003] In addition, researches are continuing on the application of the above-mentioned inkjet printing technology to the production of electronic circuits and the like. This is because, along with demands for high performance, miniaturization, and thinning of electronic devices in recent years, there are also strong demands for high density and thinning of electronic circuits ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/12H05K3/10
CPCH05K1/16H05K3/1283H05K1/095H05K3/12
Inventor 齐藤公惠富士川亘白发润
Owner DIC CORP
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