Energy-storage radiating sheet and production method thereof

Abstract

The invention discloses an energy-storage radiating sheet comprising a metal layer. One side of the metal layer is coated with a thermally conductive silica gel layer, and the other side of the metal layer is coated with a phase change material layer. A production method of the energy-storage radiating sheet includes the steps of coating the metal layer with one layer of thermally conductive silica gel by scraping, fully vulcanizing a tunnel furnace, coating the other side of the metal layer with one layer of phase change material by scraping, and cooling to obtain the energy-storage radiating sheet. The energy-storage radiating sheet has excellent thermal conductivity in metal, excellent flexibility and compressibility in thermally conductive silica gel, and phase change energy storage in phase change material; accordingly, the energy-storage radiating sheet can attain excellent thermal conductivity and heat dissipation through the effective application of interface contact; meanwhile, the energy-storage radiating sheet can store a great amount of produced heat first when a device runs at high speed so that chip operation is unaffected.

Description

[0001] technical field [0002] The invention relates to a heat sink, in particular to an energy storage heat sink and a preparation method thereof. [0003] Background technique [0004] With the rapid development of microelectronics integration technology and high-density printed board assembly technology, the assembly density has increased rapidly, the volume of electronic components and logic circuits has been reduced by thousands of times, and electronic instruments and equipment are becoming lighter, thinner, shorter and smaller. direction of development. Under high-frequency operating frequency, the working thermal environment of semiconductors moves rapidly towards high temperature. At this time, the heat generated by electronic components accumulates and increases rapidly. Under the ambient temperature of use, electronic components must still work normally with high reliability , and the ability to dissipate heat in time becomes a key limiting factor affecting its...

AI Technical Summary

Problems solved by technology

In order to ensure the operation reliability of components, it is necessary to use materials with excellent comprehensive properties such as high reliability and high thermal conductivity to quickly and timely transfer the heat accumulated by heating elements to heat dissipation equipment to ensure the normal operation of electronic equipment. Most of the existing technologies Metal heat sinks and graphite heat sinks are used. Although metal heat sinks have high thermal conductivity, their interface properties are very poor, and there is a large contact thermal resistance when in contact with heat sources. cooling

The thermal conductivity of graphite heat sinks in the longitudinal direction is very low, and its interface properties are relatively poor, and it cannot transfer heat from the heat source well.

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