Energy-storage radiating sheet and production method thereof

A technology of heat sink and energy storage, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of low thermal conductivity of graphite heat sink, inability to transfer heat to metal, poor interface properties, etc., and achieve excellent Heat dissipation and compressibility, powerful heat dissipation, excellent heat dissipation effect

Active Publication Date: 2014-01-29
SHENZHEN HFC SHIELDING PRODS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to ensure the operation reliability of components, it is necessary to use materials with excellent comprehensive properties such as high reliability and high thermal conductivity to quickly and timely transfer the heat accumulated by heating elements to heat dissipation equipment to ensure the normal operation of electronic equipment. Most of the existing technologies Metal heat sinks and graphit

Method used

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  • Energy-storage radiating sheet and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0034] Example 1:

[0035] refer to figure 1 , an energy storage heat sink, comprising a metal layer 1, a thermally conductive silica gel layer 2 is coated on one side of the metal layer 1, and a phase change material layer 3 is coated on the other side of the metal layer 1. The metal layer 1 is copper foil.

[0036] A preparation method of an energy storage fin, which comprises the following processing steps successively:

[0037] 1) Prepare raw materials: a. Take a piece of copper foil with a thickness of 0.05mm; b. Take thermal conductive silica gel base material; c. It is prepared by mixing 15 parts by weight of vinyl silica gel, 20 parts by weight of dimethyl silicone oil, 200 parts by weight of spherical alumina powder, 1 part by weight of hydrogen-containing silicone oil, and 0.5 part by weight of platinum catalyst. The phase change material base material is prepared by mixing 15 parts by weight of polyisobutylene, 10 parts by weight of paraffin wax, 74 parts by weig...

Example Embodiment

[0041] Example 2:

[0042] The features of this embodiment are: the metal layer 1 is an aluminum foil; the thermally conductive silica gel base material is composed of 4 parts by weight of methyl vinyl silicone rubber, 14 parts by weight of vinyl silica gel, 19 parts by weight of dimethyl silicone oil, It is prepared by mixing 190 parts by weight of spherical alumina powder, 0.5 part by weight of hydrogen-containing silicone oil, and 1 part by weight of platinum catalyst. The phase change material base material is prepared by mixing 14 parts by weight of polyisobutylene, 9 parts by weight of paraffin wax, 73 parts by weight of spherical alumina powder, 1 part by weight of coupling agent, and 1 part by weight of dispersant; metal layer The thickness of 1 is 0.03; the thickness of the thermally conductive silicone layer is 0.05mm. The thickness of the phase change material layer is 0.05 mm.

[0043]After testing, in this embodiment, the thermal conductivity of the aluminum rea...

Example Embodiment

[0045] Example 3:

[0046] The characteristics of this embodiment are: the metal layer is aluminum foil; the thermal conductive silica gel base material is composed of 6 parts by weight of methyl vinyl silicone rubber, 16 parts by weight of vinyl silica gel, 21 parts by weight of dimethyl silicone oil, 195 parts by weight of dimethyl silicone It is prepared by mixing the spherical alumina powder, 1.5 parts by weight of hydrogen-containing silicone oil, and 0.5 parts by weight of platinum catalyst. The phase change material base material is prepared by mixing 16 parts by weight of polyisobutylene, 11 parts by weight of paraffin wax, 75 parts by weight of spherical alumina powder, 0.5 parts by weight of coupling agent, and 0.5 parts by weight of dispersant; metal layer The thickness of 0.1; the thickness of the thermal conductive silica gel layer is 0.05mm. The thickness of the phase change material layer is 0.05 mm.

[0047] After testing, in this embodiment, the thermal cond...

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Abstract

The invention discloses an energy-storage radiating sheet comprising a metal layer. One side of the metal layer is coated with a thermally conductive silica gel layer, and the other side of the metal layer is coated with a phase change material layer. A production method of the energy-storage radiating sheet includes the steps of coating the metal layer with one layer of thermally conductive silica gel by scraping, fully vulcanizing a tunnel furnace, coating the other side of the metal layer with one layer of phase change material by scraping, and cooling to obtain the energy-storage radiating sheet. The energy-storage radiating sheet has excellent thermal conductivity in metal, excellent flexibility and compressibility in thermally conductive silica gel, and phase change energy storage in phase change material; accordingly, the energy-storage radiating sheet can attain excellent thermal conductivity and heat dissipation through the effective application of interface contact; meanwhile, the energy-storage radiating sheet can store a great amount of produced heat first when a device runs at high speed so that chip operation is unaffected.

Description

[0001] technical field [0002] The invention relates to a heat sink, in particular to an energy storage heat sink and a preparation method thereof. [0003] Background technique [0004] With the rapid development of microelectronics integration technology and high-density printed board assembly technology, the assembly density has increased rapidly, the volume of electronic components and logic circuits has been reduced by thousands of times, and electronic instruments and equipment are becoming lighter, thinner, shorter and smaller. direction of development. Under high-frequency operating frequency, the working thermal environment of semiconductors moves rapidly towards high temperature. At this time, the heat generated by electronic components accumulates and increases rapidly. Under the ambient temperature of use, electronic components must still work normally with high reliability , and the ability to dissipate heat in time becomes a key limiting factor affecting its...

Claims

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Application Information

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IPC IPC(8): H01L23/373H01L23/427H01L21/48
Inventor 谢佑南
Owner SHENZHEN HFC SHIELDING PRODS CO LTD
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