LED encapsulation method

Abstract

The invention discloses an LED encapsulation method. The method comprises the following steps: fixing insulation materials onto a radiator to form an insulating layer, and reserving a plurality of through holes in the insulating layer so as to expose the radiator; adopting solid crystal glue to fix an LED wafer onto the exposed radiator on the insulating layer; placing the LED wafer fixed by the solid crystal glue and the radiator into an oven, and baking the LED wafer and the radiator so as to enable the solid crystal glue to be solidified; connecting the positive electrode and the negative electrode of the LED wafer fixed on the radiator through a guide line to form series connection or parallel connection; mixing silica gel and fluorescent powder to obtain fluorescent glue, controlling the color temperature of the fluorescent glue to be 2000K-8000K; pointing the fluorescent glue in the center of the LED wafer, and enabling the fluorescent glue to cover the through holes in the insulating layer; placing the radiator going through glue pointing into the oven for baking, and enabling the fluorescent glue to be solidified. The method simplifies encapsulation processes, is good in heat dissipating effect, and improves the high-pressure resisting performance of an LED encapsulation structure.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to an LED packaging method. Background technique [0002] With the development of LED chip technology and packaging technology, more and more LED products are used in the lighting field. Due to the characteristics of high luminous efficiency, energy saving and environmental protection, suitable dimming control, and no mercury and other pollutants, LEDs have become the successor to incandescent lamps. A new generation of lighting sources after traditional light sources such as fluorescent lamps and fluorescent lamps. Since LED is an electroluminescent semiconductor device, about 30% of the electric energy is converted into light when it emits light, and the remaining electric energy is converted into heat, and the temperature rise of LED caused by heat accumulation is the main cause of LED light decay. reason. Therefore, the heat dissipation performance of the LED chip is a crucial fac...

AI Technical Summary

Problems solved by technology

In the packaging structure made by this packaging method, the heat diffuses to the heat sink through the narrow lamp bead pins and the insulating layer of the aluminum substrate, and finally diffuses into the air from the heat sink. The heat dissipation path is too long and narrow, and the heat dissipation effect is poor.

Moreover, because the production of lamp beads includes stamping of lamp bead brackets, bracket electroplating, bracket injection molding, lamp bead crystal fixation, soldering gold wires, spotting silica gel phosphors, baking, lamp bead light splitting, and lamp bead packaging, the process is complicated and the packaging cost is high. high

At the same time, in this structure, since the surface on which the LED chip is installed on the heat sink is not completely insulated, its high voltage resistance is low.