Thermosetting resin composition and application thereof

A resin composition and thermosetting technology, applied in the fields of resin glue, prepreg and laminate, can solve the problems affecting the insulation performance of copper clad laminates, and achieve the effects of improving mechanical properties, less content and reducing light transmittance

Active Publication Date: 2014-02-12
GUANGDONG SHENGYI SCI TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, graphene can endow copper-clad laminates with black characteristics, but there is no disclosure of using graphene-coated inorganic particles in black copper-clad laminates in the prior art, mainly because graphene is a good conductor. The addition of it will affect the insulation performance of the copper clad laminate

Method used

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  • Thermosetting resin composition and application thereof
  • Thermosetting resin composition and application thereof
  • Thermosetting resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-8

[0055] Examples 1-8 The solid component formula composition is shown in Table 1, and methyl ethyl ketone is used to prepare a thermosetting epoxy resin glue used in the manufacture of laminates, wherein the solid component accounts for 67%.

[0056] The copper clad substrates of Examples 1-8 were prepared according to the following preparation process:

[0057] (1) Glue making: Add the solvent into the batching container, add epoxy resin, curing agent solution and curing accelerator solution respectively under stirring; after stirring for 2 hours, add inorganic filler, continue stirring for 4-8 hours, then take a sample test The gelling time of the glue (170°C constant temperature hot plate) is 200-300 seconds.

[0058] (2) Impregnation: Pass the reinforced material layer soaked in glue through a vertical or horizontal impregnation machine, and control the extrusion wheel speed, line speed, wind temperature and furnace temperature. The specific example of the vertical impregna...

Embodiment 8

[0065] The difference between embodiment 8 and embodiment 4 is that the reinforcing material used in embodiment 8 is coated with graphene oxide, the quality of graphene oxide is 0.5wt% of the quality of the reinforcing material, the thickness of graphene oxide is 2 nanometers, and the average width 0.1 micron, the reinforcing material used in Example 4 has not been treated with graphene oxide, and the rest are the same.

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Abstract

The invention discloses a thermosetting resin composition. The thermosetting resin composition comprises thermosetting resin and inorganic filler, wherein the inorganic filler is coated with graphene oxide or graphene, and the mass of the graphene oxide or the graphene is 0.01 to 5 percent of the mass of the inorganic filler. By adding the inorganic filler which is coated with graphene or graphene oxide, the light transmittance of a copper-foil-clad substrate is greatly reduced on the premise that the insulation of the prepared copper-foil-clad substrate is not reduced.

Description

technical field [0001] The invention relates to a thermosetting resin composition and its application, in particular to a thermosetting resin composition and resin glue, prepreg and laminate obtained therefrom. Background technique [0002] Metal foil clad board is a plate-shaped material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin solution, covering one or both sides with metal foil and hot pressing. It is called metal foil clad laminate ( Copper Clad Laminate, CCL), referred to as metal clad board. Metal clad board is the substrate material for manufacturing printed circuit board (PCB for short), and PCB is one of the important components of the electronics industry. Almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, printed boards are u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/04C08K9/10C08K3/36C08K7/14B32B27/04B32B15/092H05K1/03
Inventor 柴颂刚苏晓声
Owner GUANGDONG SHENGYI SCI TECH
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