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Anodic automatic bonding equipment

An equipment and anode technology, applied in the field of bonding equipment in microelectronics technology, can solve the problems of insufficient functions of anode bonding technology equipment, and achieve the effects of high reliability, widening application scope and precise control

Inactive Publication Date: 2014-03-12
SUZHOU DINA PRECISION EQUIP
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] However, the existing anodic bonding technology is slightly insufficient in terms of equipment functions. In many practical cases, bonding needs to be completed under specific environmental conditions, such as vacuum environment, special atmosphere environment, and high pressure environment, etc., and in some cases Before the bonding operation, the sample needs to be specially treated and operated. These requirements require a targeted design of the bonding equipment, and factors such as ease of operation, reliability and efficiency must be taken into account.

Method used

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Embodiment Construction

[0019] The present invention will be further described below in conjunction with the drawings.

[0020] Such as figure 1 , Is a schematic diagram of the structure of the present invention, is an anode automatic bonding equipment, including a bonding treatment heating furnace 9, the upper part of which has a workpiece suction rod 7, the workpiece suction rod 7 is installed in the vertical movement of the lifting mechanism On 6, one side of the lifting and moving mechanism 6 is installed with a visual microscopy system 4 and an intelligent temperature adjustment table 3; a displacement rotating platform 10 is installed at the bottom of the bonding treatment heating furnace. The displacement rotary platform 10 moves through a rotary sliding table 11 installed at its bottom. The installation slot of the rotary sliding table is opened on the casing 5 of the anode automatic bonding equipment; a ceramic heat insulation sheet 12 is provided between the displacement rotary platform and the...

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Abstract

The invention discloses anodic automatic bonding equipment. The anodic automatic bonding equipment comprises a bonding processing heating furnace which is provided with a component sucking rod at the upper part; the component sucking rod is mounted onto a lifting and moving mechanism which can move vertically; a visual microscopic system and an intelligent temperature control meter are mounted at one side of the lifting and conveying mechanism; and a displacement and rotation platform is mounted at the bottom part of the bonding processing heating furnace. The anodic automatic bonding equipment can meet the bonding condition of a micro electro mechanical system, enables high quality of a product after bonding through intelligent control, is simple and convenient to operate, and also expands the scope of industrial application of anodic bonding.

Description

Technical field [0001] The invention relates to an anode automation key and equipment, belonging to the technical field of bonding equipment in microelectronic technology. Background technique [0002] Micro-electromechanical systems, also known as micro-systems or micro-machines (Micro electronic mechanical system, MEMS for short) is a multidisciplinary cutting-edge research field developed on the basis of microelectronics technology, and is known as a very revolutionary high-tech in the 21st century. It involves microelectronics, micromechanics, microoptics, materials science, information and control, as well as physics, chemistry, biology and many other disciplines, and integrates many high-tech achievements of today's science and technology. MEMS is a multifunctional, high-precision microelectronic mechanical equipment system integrating micro-machines, micro-sensors, micro-actuators, information processing, and intelligent control. Its technical goal is to achieve the integ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C3/00
Inventor 陈涛潘明强陈立国王阳俊刘吉柱
Owner SUZHOU DINA PRECISION EQUIP
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