Large-power conductive chip adhesive

An adhesive and high-power technology, applied in the direction of conductive adhesives, adhesives, adhesive types, etc., can solve the problems of low weight loss and difficulty in increasing the amount of silver added, so as to reduce volatiles, improve reliability, and improve The effect of adhesion

Inactive Publication Date: 2014-03-12
CHANGCHUN YONGGU TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of conductive adhesive overcomes the shortcomings of traditional conductive adhesives, which have many solvents / diluents, and the amount of silver added is difficult to increase. It increases the weight percentage of silver from 60% to 80% to 85% to 90%, and maintains good operability and low weight loss. features

Method used

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  • Large-power conductive chip adhesive
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Components (ingredients) of high-power conductive die-attach:

[0027]

[0028] The preparation method of the above-mentioned high-power conductive chip adhesive is: mix the coupling agent, the curing agent and the diluent evenly according to the above formula ratio, then add epoxy resin and modified epoxy resin to stir, and mix the two silver powders, Slowly add to the liquid, continue to stir until uniform, and finally remove the air bubbles in a vacuum to obtain a conductive adhesive.

[0029] The adhesive viscosity is 9561cps (25°C, 5rpm, Brookfield DV-3), cured at 160°C for 1 hour, the measured horizontal shear force is 20MPa, and the horizontal shear force is 9MPa at 270°C. The volume resistivity is 0.00003ohm cm. The conductivity is 15W / mK, and the curing weight loss is 7.5%.

Embodiment 2

[0031] Components (ingredients) of high-power conductive die-attach:

[0032]

[0033]

[0034] The preparation method of the above-mentioned high-power conductive chip adhesive is: mix the coupling agent, the curing agent and the diluent evenly according to the above formula ratio, then add epoxy resin and modified epoxy resin to stir, and mix the two silver powders, Slowly add to the liquid, continue to stir until uniform, and finally remove the air bubbles in a vacuum to obtain a conductive adhesive.

[0035] The adhesive viscosity is 19233cps (25°C, 5rpm, Brookfield DV-3), cured at 180°C for 1 hour, the measured horizontal shear force at room temperature is 15MPa, the horizontal shear force at 270°C is 5.5MPa, and the volume resistivity is 0.00001ohm· cm, the thermal conductivity is 25W / mK, and the curing weight loss is 5.5%.

Embodiment 3

[0037] Components (ingredients) of high-power conductive die-attach:

[0038]

[0039] The preparation method of the above-mentioned high-power conductive chip adhesive is: mix the coupling agent, the curing agent and the diluent evenly according to the above formula ratio, then add epoxy resin and modified epoxy resin to stir, and mix the two silver powders, Slowly add to the liquid, continue to stir until uniform, and finally remove the air bubbles in a vacuum to obtain a conductive adhesive.

[0040] The adhesive viscosity is 16018cps (25℃, 5rpm, Brookfield DV-3), cured at 150℃ for 1.5 hours, the measured horizontal shear force is 17MPa, the horizontal shear force at 270℃ is 7.5MPa, and the volume resistivity is 0.00001ohm·cm , The thermal conductivity is 21W / mK, and the curing weight loss is 6.2%.

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Abstract

The invention relates to a large-power conductive chip adhesive, belonging to the technical field of an adhesive applied to microelectronic packaging. The conductive chip adhesive consists of flake silver powder, epoxy resin, acrylate-modified epoxy resin, a curing agent, a coupling agent and a diluting agent. By adopting two-peak distribution of micrometer silver powder, the filling capacity of silver can be improved, and the large-power modified epoxy resin conductive chip adhesive with high electrical conductivity and high heat conductivity can be realized; the acrylate-modified epoxy resin is a copolymerization product of glycidyl methacrylate and two to three acrylic ester monomers and / or olefin monomers. The large-power conductive chip adhesive has the effects that the high-temperature resistance and high-humidity resistance and aging resistance property of the epoxy resin adhesive can be improved, the volume resistivity is low, and the bonding strength is high; the large-power conductive chip adhesive is applicable to electronic packaging requirements on lead-free and high-temperature and high-humidity environments, the packaging reliability can be enhanced, and the service lives of packaged devices can be prolonged.

Description

technical field [0001] The invention discloses a modified epoxy resin conductive adhesive which utilizes Bimodal bimodal distribution micron silver powder to increase the silver filling amount and realize high electrical conductivity and high thermal conductivity. It is used as a chip adhesive for high-power LEDs and power devices, and is applied in the field of microelectronic packaging. . Background technique [0002] LED chip packaging technology is one of the core technologies of LED device manufacturing, and heat dissipation has become a key problem in packaging technology for high-power LEDs (power not less than 0.5 watts). LED devices can only convert less than 20% of the input power into light energy, and the remaining 80% of the energy will be dissipated in the form of heat, which leads to poor heat dissipation, increased chip temperature, reduced luminous efficiency, and impure light color. shortened working life of devices. The die-attach agent that bonds the di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J133/12C09J133/10C09J133/08C09J11/06C09J11/04C09J9/02
Inventor 郑岩王群刘姝王政孙莉李中亮苏立君
Owner CHANGCHUN YONGGU TECH
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