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A kind of preparation method of symmetrical rigid-flex board

A rigid-flex board, symmetrical technology, applied in the direction of electrical connection formation of printed components, assembly of printed circuits with electrical components, etc., to achieve stable production and supply, increase hole design density, and simplify complexity

Active Publication Date: 2016-07-06
BOMIN ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to address the deficiencies of the prior art and provide a method for preparing a symmetrical rigid-flex board with high processing stability and low cost. In this method, the laser half-cutting of the rigid copper-clad substrate that needs to expose the flexible area is added in advance. area, to prevent solution intrusion caused by completely cutting the rigid copper-clad substrate, simplify the complexity of shape processing, reduce the use of cover film to reduce the mismatch of thermal expansion of materials, and help improve the pass rate of rigid-flex board production

Method used

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  • A kind of preparation method of symmetrical rigid-flex board
  • A kind of preparation method of symmetrical rigid-flex board
  • A kind of preparation method of symmetrical rigid-flex board

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preparation example Construction

[0027] refer to Figure 1 to Figure 7 Shown, a kind of preparation method of symmetrical rigid-flex board of the present invention, this method comprises the following steps:

[0028] (1) Prepare a flexible copper-clad laminate, and divide the flexible copper-clad laminate into several flexible units spaced apart according to product specifications; the preparation of the flexible copper-clad laminate is specifically:

[0029] (a) Drill holes on the flexible copper-clad base material of the inner layer. After the holes are drilled, they are cleaned by a wet method, and then electroless plating and electroplating are performed to complete the metallization of the inner layer holes; the flexible copper-clad substrate described in this embodiment The copper-clad substrate is a double-sided copper-clad substrate, and the dielectric layer in the substrate is polyimide or liquid crystal polymer. Flexible copper-clad substrates can also be selected as single-sided copper-clad substr...

Embodiment 1

[0041] refer to Figure 2 to Figure 7 As shown, a four-layer rigid-flex board and a hole interconnection processing method are provided.

[0042] Use a cutting machine to cut flexible double-sided copper-clad laminates, rigid single-sided copper-clad laminates, thermosetting adhesives, and polyimide cover films that are suitable for the processing size. At the same time, according to the product specifications, the flexible double-sided copper-clad laminate and the rigid single-sided copper-clad laminate are divided into several flexible units and rigid units that are spaced apart from each other.

[0043] Step 1: Carry out numerical control drilling on the inner flexible double-sided copper-clad substrate, then use potassium permanganate solution to clean the drilled holes, and then perform electroless plating and electroplating to complete the metallization of the inner holes; The dielectric layer of the flexible copper-clad substrate used is polyimide.

[0044] Step 2: Co...

Embodiment 2

[0051] refer to Figure 2 to Figure 7 and Figure 8 with Figure 9 As shown, a six-layer rigid-flex board and a hole interconnection processing method are provided.

[0052] Use a cutting machine to cut flexible double-sided copper-clad laminates, rigid single-sided copper-clad laminates, thermosetting adhesives, and polyimide cover films that are suitable for the processing size. At the same time, according to the product specifications, the flexible double-sided copper-clad laminate and the rigid single-sided copper-clad laminate are divided into several flexible units and rigid units that are spaced apart from each other.

[0053] Step 1: Carry out numerical control drilling on the inner flexible double-sided copper-clad substrate, then use potassium permanganate solution to clean the drilled holes, and then perform electroless plating and electroplating to complete the metallization of the inner holes; The dielectric layer of the flexible copper-clad substrate used is p...

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Abstract

The invention discloses a method for preparing a symmetrical rigid-flex board; it belongs to the technical field of rigid-flex board manufacturing technology; its technical points include the following steps: (1) preparing a flexible copper-clad board; (2) preparing a rigid copper-clad board ; (3) Groove each rigid unit on the surface of the rigid copper-clad laminate without copper foil. The size of the area between the two grooves is the same as the area of ​​the flexible copper-clad laminate to be exposed; The board surface without copper foil of the copper plate and the flexible copper-clad laminate are bonded by adhesive to form a rigid-flexible composite board; (5) transfer the pattern of the rigid-flexible composite board, and then print and cure the solder resist ink; (6) Cut out each semi-finished unit along the outer contour of the rigid unit according to the product plan, and then perform half-cut processing on each semi-finished product by a CNC punching machine to expose the flexible area, thereby obtaining a rigid-flexible board; the present invention aims to provide a rigid-flexible board with high processing stability A method for preparing a symmetrical rigid-flex board with low cost; it is suitable for the production of rigid-flex boards.

Description

technical field [0001] The invention relates to a method for preparing a printed circuit board, and more specifically, to a method for preparing a symmetrical rigid-flex board. Background technique [0002] The multi-functional development of electronic information products requires the development of electronic assembly in a three-dimensional direction, and the requirements for printed circuit boards carrying components gradually extend from multi-layer to high-density and multi-dimensional assembly. Rigid-flex boards have both the high-density capabilities of rigid printed circuit boards and the flexural deformation performance of flexible printed circuits. It is an important accessory to realize the high intelligence and multi-function of electronic information products. Rigid-flex boards have been widely used in high-end electronic information products such as scanners, digital cameras, notebook computers and aerospace. [0003] At present, there are five main types of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/36H05K3/42
Inventor 周华江俊锋陈苑明陈世金邓宏喜何为
Owner BOMIN ELECTRONICS CO LTD
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