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Electrolytic copper foil, method for producing electrolytic copper foil, and lithium ion secondary cell using electrolytic copper foil as collector

A technology for electrolytic copper foil and copper foil, which is applied in the field of non-aqueous electrolyte secondary batteries and can solve problems such as undisclosed technologies

Active Publication Date: 2014-03-19
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these documents do not disclose specific techniques for obtaining a copper foil having a tensile strength of 300 MPa or more after heating at 350°C for 1 hour and a tensile rate of 3.0% or more after heating at 350°C for 1 hour.

Method used

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  • Electrolytic copper foil, method for producing electrolytic copper foil, and lithium ion secondary cell using electrolytic copper foil as collector
  • Electrolytic copper foil, method for producing electrolytic copper foil, and lithium ion secondary cell using electrolytic copper foil as collector
  • Electrolytic copper foil, method for producing electrolytic copper foil, and lithium ion secondary cell using electrolytic copper foil as collector

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0052] Hereinafter, the present invention will be described in detail based on examples.

example 1~15

[0053]

[0054] In the following copper sulfate electrolytic bath, add one or more compounds selected from compounds having a structure in which an SH group is bonded to an N heterocycle or thiourea compounds, and hydroxyethyl cellulose in the amount shown in Table 1 (HEC) or low molecular weight glue (PBF), after forming the electrolyte, place a titanium roller, and make an electrolytic copper foil film under the following electrolytic conditions.

[0055] Composition of copper sulfate electrolytic bath :

[0056] Copper (Cu) 70g / l

[0057] Sulfuric acid (H 2 SO 4 ) 50g / l

[0058] Chloride ion 30ppm

[0059] Electrolysis conditions :

[0060] Current density 40A / dm 2

[0061] Temperature 45°C

[0062]

[0063] Next, roughening plating was performed only on the S surface on the roll side. The roughening plating conditions are as follows. Coarse processing:

[0064] (A) Overfired electroplating for roughening treatment:

[0065] Copper 30g / dm 3 , and sulfu...

example 16、17

[0077]

[0078] According to the electrolyte composition and electrolysis conditions shown in Table 3, electrolytic copper foil was produced.

[0079] The untreated copper foil thus produced was subjected to the same surface treatment as in Example 1 above.

[0080] table 3

[0081]

[0082]Under the combined roughening conditions shown in Table 2 and Table 4, the smooth surface (S surface) of the electrolytic copper foil obtained in each example and comparative example was roughened, and the surface area of ​​the roughened surface, Sm, was measured. As well as the surface roughness Rz, Ra, Ry, Sm of the rough surface, calculate the surface area ratio of the S surface and the M surface to the geometric surface. For example, use a laser microscope (manufactured by KEYENCE, VK-8700 / 9700) to observe the range of 50 μm × 50 μm (2500 μm2), and if the measurement result is 2500 μm 2 , the surface area ratio is set to be 1. The results and charge and discharge efficiencies ...

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Abstract

Provided is an electrolytic copper foil having a tensile strength of 300 MPa or greater and an elongation percentage of 3.0% or greater after heat treatment at 350 C or higher for one hour. Also provided is a copper foil with which adhesiveness between the collector (copper foil) and active substance is maintained but the collector (copper foil) does not tear when exposed to the extreme expansion and contraction of an Si or Sn alloy active substance. The electrolytic copper foil is a surface roughed electrolytic copper foil wherein the tensile strength after heating of the copper foil at 350 C for one hour is 300 MPa or greater, the elongation percentage after heating at 350 C for one hour is 3.0% or greater, and the two faces, the roughed face and the unroughed face, have a surface area ratio (actual surface area / geometric surface area) between 1.6 and 2.2. The electrolytic copper foil is produced using an electrolyte that is obtained by adding between 0 and 12 ppm of hydroxyethyl cellulose or low-molecular-weight starch and between 10 ppm and 80 ppm of chlorine ions to a copper sulfate electrolyte containing between 3 and 20 ppm of one or more organic additives selected from the group consisting of thiourea compounds and compounds having a structure wherein SH groups are bonded to a heterocycle containing N.

Description

technical field [0001] The present invention relates to a non-aqueous electrolyte secondary battery with a positive electrode, a negative electrode with a negative electrode active material layer formed on the surface of a negative electrode current collector, and a non-aqueous electrolyte, such as a lithium ion secondary battery, and relates to a particularly suitable structure Electrolytic copper foil of the battery negative electrode current collector. Background technique [0002] In recent years, the development of a new generation of negative electrode active materials having a charge and discharge capacity that greatly exceeds the theoretical capacity of carbon materials as negative electrode active materials for lithium ion secondary batteries has been progressing. For example, it is desired to develop materials containing metals such as silicon (Si) and tin (Sn) that can be alloyed with lithium (Li). [0003] These active materials such as Si and Sn have poor elect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/04C25D1/00C25D7/06H01M4/66
CPCH01M4/386H01M4/661C25D1/04H01M4/667H01M10/0525C25D3/38H01M4/387H01M10/052H01M4/0452C25D5/50H01M4/134Y02E60/122Y02E60/10C25D7/06H01M4/66
Inventor 筱崎健作铃木昭利
Owner FURUKAWA ELECTRIC CO LTD
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