Double-microcapsule-component conductive adhesive

A technology of microcapsules and conductive adhesives, applied in the field of conductive adhesives, can solve the problems of limited storage life, high requirements for substrates, and low efficiency, and achieve the effect of easy control of parameters and simple process

Active Publication Date: 2014-03-26
JIANGSU RUIDE NEW ENERGY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One is to use a microencapsulated curing agent and make the epoxy resin component in the conductive adhesive excessive. The disadvantage is that the excessive epoxy resin component affects the mechanical properties of the conductive adhesive after curing.
The second is to use microencapsulated epoxy resin and add latent curing agent with slow curing rate in the microcapsule. The disadvantage is that the latent curing agent has a storage life limit in the microcapsule. The fluidity of the epoxy resin becomes poor, which affects the repair effect; in addition, when repairing, the latent curing agent cures the epoxy resin at a slow rate and low efficiency, or requires heating to achieve curing, which requires higher substrates for conductive adhesives

Method used

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  • Double-microcapsule-component conductive adhesive
  • Double-microcapsule-component conductive adhesive
  • Double-microcapsule-component conductive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6

[0032] The present invention is a double microcapsule component conductive adhesive, which consists of epoxy resin I, flake silver powder, curing agent I, epoxy diluent I, coupling agent, microcapsule type epoxy resin particles and microcapsule type The curing agent particles, the parts by weight of each component are shown in Table 1. There are many options for epoxy resin I, curing agent I, and epoxy diluent I, which can meet the curing requirements of conductive adhesives in the temperature range of 60-80°C. Replace the corresponding products in Table 1. Weigh each component according to Table 1, and mix each component uniformly at room temperature to obtain a conductive adhesive.

[0033] Table 1: Content table of each raw material component of conductive adhesive

[0034]

[0035] The wall material of above-mentioned microcapsule type epoxy resin particle is polymethyl methacrylate; Core material comprises epoxy resin II, 20~200nm silver powder, epoxy diluent II acco...

Embodiment 1

[0038] In Example 1, the above-mentioned microcapsule-type epoxy resin particles are prepared by the following steps: Weigh 120g of deionized water, add 1.6g of emulsifier, 0.1g of dispersant, 100g of core material, and 20g of methyl methacrylate monomer to disperse Evenly, heat and stir in a water bath at 50°C to form an O / W emulsion, then add 0.02g initiator dropwise, react for 1h, then stir and cool to room temperature, centrifuge, wash with deionized water, and then vacuum dry at 50°C for 12h, Obtain microcapsule type epoxy resin particle; Wherein, described emulsifier is the mixture of OP-10 and sodium dodecylbenzene sulfonate by weight ratio 3: 1, and described dispersant is polyvinyl alcohol, and described initiator For benzoyl peroxide.

Embodiment 2

[0039]In Example 2, the above-mentioned microcapsule-type epoxy resin particles were prepared by the following steps: Weigh 200g deionized water, add 2.25g emulsifier, 0.15g dispersant, 130g core material, 25g methyl methacrylate monomer dispersion Uniform, heated and stirred in a 65°C water bath to form an O / W emulsion, then added dropwise 0.025g initiator, reacted for 2h, then stirred and cooled to room temperature, centrifuged, washed with deionized water, and then vacuum-dried at 50°C for 24h, Obtain microcapsule type epoxy resin particle; Wherein, described emulsifying agent is the mixture of OP-10 and sodium dodecylbenzene sulfonate by weight ratio 2: 1, and described dispersant is polyvinyl alcohol, and described initiator for ammonium persulfate.

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Abstract

The invention relates to a double-microcapsule-component conductive adhesive which comprises the following components in parts by weight: 100 parts of epoxy resin I, 250-900 parts of flaky silver powder, 10-50 parts of curing agent I, 10-40 parts of epoxy diluter I, 3-20 parts of coupling agent, 3-15 parts of microcapsule type epoxy resin granule and 1-5 parts of microcapsule type curing agent granule. After cracking, the conductive adhesive can be restored, thereby having long service life. Epoxy resin II, curing agent II and the like for curing cracks are respectively stored in the double microcapsule components and are separated from each other, so that the components can not be subjected to curing reaction before cracking, thus ensuring that the curing agent II and the epoxy resin II can not be tackified with time, ensuring that the double microcapsule components have permanent restoration effect, and reducing the requirements for conductive adhesive coated substrates. Besides, the main body component epoxy resin I of the conductive adhesive dose not need to be excessive, thus ensuring that the cured conductive adhesive has favorable mechanical property.

Description

technical field [0001] The invention relates to a conductive adhesive, in particular to a conductive adhesive with double microcapsule components. Background technique [0002] As a development trend of conductive adhesives, repairable conductive adhesives are of great significance because they can improve the reliability and service life of electrical conduction and expand the application fields of conductive adhesives. [0003] The self-healing of conductive adhesive requires its curing component and epoxy resin component. There are currently two repair methods. One is to use a microencapsulated curing agent and make the epoxy resin component in the conductive adhesive excessive. The disadvantage is that the excessive epoxy resin component affects the mechanical properties of the conductive adhesive after curing. The second is to use microencapsulated epoxy resin and add latent curing agent with slow curing rate in the microcapsule. The disadvantage is that the latent cu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J163/02C09J163/04C09J11/00B01J13/18
Inventor 戈士勇
Owner JIANGSU RUIDE NEW ENERGY TECH
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