Disposable scaling powder used for high-temperature soldering

Abstract

The invention discloses disposable scaling powder used for high-temperature soldering. The disposable scaling powder is characterized by comprising the following ingredients in parts by weight: 1-5 parts of modified rosin, 0.5-2 parts of dicarboxylic acid active agent, 0.1-0.5% part of non-ionic surface active agent, 20-30 parts of rosin cycloparaffin, 60-75 parts of alcohols solvent, 0.05-0.5 part of heterocyclic compound. Due to the adoption of the technical scheme, the scaling powder has the characteristics that the energy storage stability is high, the smoke is little when passing by a furnace, the insulation resistance left after welding is high, the corrosivity is low, the electrical property is excellent and the like, and is suitable for the cleaning-free process of industries such as electrical inductance, network transformer and capacitance.

Description

Technical field [0001] The invention relates to the field of materials, in particular to a no-clean flux for high-temperature soldering. Background technique [0002] At present, domestic environmentally friendly no-clean fluxes are mostly used for printed circuit boards (welding at 245-270°C). Some of them contain rosin and low-residue halogen-free no-clean fluxes without rosin, but these fluxes are used When soldering at high temperature (440-450℃), the biggest problem is: due to the introduction of low-carbon chain organic carboxylic acids in this type of flux, and the amount is high, especially the low-residue, halogen-free and no-clean without rosin The soldering flux relies on some high-boiling ester solvents as the film-forming agent, so the soldering flux has high corrosiveness and low impedance, especially in humid conditions. [0003] In high-temperature welding, the type of rosin + organic acid + halogen is still widely used. The problems of this type of flux: either hi...

AI Technical Summary

Problems solved by technology

[0002] At present, domestic environmental protection no-clean fluxes are mostly used for printed circuit boards (soldering at 245-270°C). When soldering at high temperature (440-450°C), the biggest problem is: due to the reference of low-carbon chain organic carboxylic acids in this type of flux, and the high dosage, especially the low-residue halogen-free no-clean without rosin Soldering flux relies on some high-boiling-point ester solvents as film-forming agents, so the flux has high corrosiveness and low impedance, especially in wet conditions.

[0003] In high-temperature welding, the type of rosin + organic acid + halogen is still widely used. The problems of this type of flux: either the content of rosin is high, or corrosive substances are added to improve welding performance: low carbon chain Organic carboxylic acids, halogens

[0004] At present, there are also environmentally friendly no-clean fluxes reported abroad, but there are few special-purpose high-temperature soldering fluxes. At present, Japan Senzhu has a product of this type, but in the use of domestic users, facing many product types, there are narrow use windows and adjustments. Slow speed, long lead time, expensive

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