Tin-lead solder for brazing copper radiator

Abstract

The invention relates to a brazing solder, in particular to a tin-lead solder for brazing a copper radiator. The tin-lead solder comprises Sn, Pb and microelements. The tin-lead solder is low in melting temperature, good in mechanical property and not high in price, and has good wettability and spreading performance; the brazed copper radiator is good in stability, high in welding efficiency, reliable in quality, thin and firm in weld seam, free of pseudo soldering and solder accumulation, good in performance and good in cost performance, and residues produced after welding can be easily cleaned away.

Description

technical field [0001] The invention relates to a brazing filler metal, in particular to a tin-lead filler metal for copper radiator brazing. Background technique [0002] Copper and copper alloys have been widely used for their excellent electrical conductivity and thermal conductivity, and copper radiators take advantage of the good thermal conductivity of copper, and are widely used in passenger cars, construction machinery and generator sets. However, copper-based brazing has high requirements for solder, brazing temperature and equipment, resulting in high cost of copper-based brazing, so material workers began to study copper-based brazing. SUMMARY OF THE INVENTION [0003] The present invention aims to solve the above problems, and provides a tin-lead solder for copper radiator brazing, which has lower melting temperature and better wetting performance, and is an ideal tin-lead solder for copper radiator brazing , the technical solutions adopted are as follows: ...

AI Technical Summary

Problems solved by technology

However, copper-based brazing requires high brazing material, brazing temperature and equipment, resulting in high cost of copper-based brazing, so material workers began to devote themselves to the study of copper-based soldering