Linking agent, organic ceramic material, organic ceramic circuit board and preparation method thereof

Abstract

The invention discloses a linking agent, an organic ceramic material, an organic ceramic circuit board and a preparation method thereof. The linking agent comprises, by weight, 10-30 parts of a barium phenolic resin, 2-10 parts of an E06 epoxy resin, 0.5-5 parts of meta-phenylenediamine, 8-15 parts of asbestos powder and a proper amount of methyl ethyl ketone. The organic ceramic material comprises, a linking agent accounting for 5-50% that of a total weight of the organic ceramic material, and a coupling agent accounting for 0.05-1% that of a total weight of the organic ceramic material. The linking agent, the organic ceramic material, the organic ceramic circuit board and the preparation method thereof are provided by the invention. The linking agent is formed by mixing the barium phenolic resin, the E06 epoxy resin, the meta-phenylenediamine powder and methyl ethyl ketone; the cross-linking agent can be bonded with the ceramic material in presence of the coupling agent, so that the ceramic material can be shaped at a relatively low temperature; the strength of a prepared organic ceramic wafer is improved; and heat conductivity coefficient is increased.

Description

technical field [0001] The invention relates to the field of ceramic materials, in particular to a coupling agent, an organic ceramic material, an organic ceramic circuit board and a preparation method thereof. Background technique [0002] With the gradual deepening of electronic technology in various application fields, the high integration of circuit boards has become an inevitable trend. Highly integrated modules require a good heat dissipation carrying system, while traditional circuit boards FR-4 and CEM-3 are in TC (thermal conductivity) The disadvantages in technology have become a bottleneck restricting the development of electronic technology. The LED industry, which has developed rapidly in recent years, has also put forward higher requirements for the TC index of its load-carrying circuit boards. In the field of high-power LED lighting, materials with good heat dissipation properties such as metal and ceramics are often used to prepare circuit substrates. At pre...

AI Technical Summary

Problems solved by technology

Among them, HTCC is an earlier developed technology. Since its process temperature needs to reach above 1300°C, the selection of electrodes used is limited, and the preparation cost is quite expensive.

Although the process temperature of LTCC is reduced to 850°C, the accuracy of the prepared circuit is relatively poor, and the thermal conductivity of the finished product is also low; the preparation method of DBC requires the formation of an alloy between copper foil and ceramics, and the calcining temperature needs to be strictly controlled at 1065-1085°C In the temperature range, because the preparation method of DBC has requirements on the thickness of the copper foil, generally not less than 150~300 microns, so the width-to-depth ratio of the wires of this type of ceramic circuit board is limited.

[0004] At present, the popular high thermal conductivity ceramic substrates on the market are generally prepared by DPC. The manufacture of DPC is carried out by repeated chemical plating on the surface of the ceramic plate for metal deposition, so that the surface produces conductors. However, the conductor on the surface of this ceramic plate is thin. , low peel strength, can not be machined