Compound conductive adhesive for electronic packaging and preparation method thereof

A composite conductive and electronic packaging technology, applied in the field of conductive adhesive, can solve the problems of low electrical conductivity and thermal conductivity, restricting high-power LED chips of silver-based conductive adhesives and high-end applications of large integrated circuits, etc., to improve thermal conductivity and The effect of electrical conductivity and good electrical conductivity

Inactive Publication Date: 2014-05-21
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conductive adhesive prepared by pure silver powder has relatively low electrical conductivity and thermal conductivity due to the gap between the silver powder, which restricts the high-end application of silver-based conductive adhesive on high-power LED chips and large integrated circuits.

Method used

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  • Compound conductive adhesive for electronic packaging and preparation method thereof
  • Compound conductive adhesive for electronic packaging and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Step 1): Activation treatment of carbon nanotubes

[0031] (1) The carbon nanotubes were added into the mixed acid solution, and ultrasonically treated for 60 min to obtain the suspension mixture. Heat the mixture to reflux in a water bath at 60°C for 5 hours, then dilute with deionized water, filter under reduced pressure, and wash until neutral to obtain separated carbon nanotubes. Put the obtained separated carbon nanotubes into a watch glass placed in an oven at 60°C for 24 hours to obtain acidified carbon nanotubes, the mixed acid solution is composed of concentrated sulfuric acid with a mass fraction of 98% and concentrated nitric acid with a mass fraction of 65% and potassium permanganate according to the mass ratio 3:0.85:0.15, the amount of carbon nanotubes added is 1g per 100mL of mixed acid solution.

[0032] (2) The acidified carbon nanotubes were added to the activation solution, ultrasonically treated for 30 min, and placed in a water bath at 40° C. for 2...

Embodiment 2

[0037] Step 1): Activation treatment of carbon nanotubes

[0038] (1) The carbon nanotubes were added into the mixed acid solution, and ultrasonically treated for 60 min to obtain the suspension mixture. Heat the mixture to reflux in a water bath at 60°C for 5 hours, then dilute with deionized water, filter under reduced pressure, and wash until neutral to obtain separated carbon nanotubes. Put the obtained separated carbon nanotubes into a watch glass placed in an oven at 60°C for 24 hours to obtain acidified carbon nanotubes, the mixed acid solution is composed of concentrated sulfuric acid with a mass fraction of 98% and concentrated nitric acid with a mass fraction of 65% and potassium permanganate according to the mass ratio 3:0.85:0.15, the amount of carbon nanotubes added is 1.25g per 100mL mixed acid solution.

[0039] (2) The acidified carbon nanotubes were added to the activation solution, ultrasonically treated for 30 min, and placed in a water bath at 40° C. for 2...

Embodiment 3

[0044] Step 1): Activation treatment of carbon nanotubes

[0045] (1) The carbon nanotubes were added into the mixed acid solution, and ultrasonically treated for 60 min to obtain the suspension mixture. Heat the mixture to reflux in a water bath at 60°C for 5 hours, then dilute with deionized water, filter under reduced pressure, and wash until neutral to obtain separated carbon nanotubes. Put the obtained separated carbon nanotubes into a watch glass placed in an oven at 60°C for 24 hours to obtain acidified carbon nanotubes, the mixed acid solution is composed of concentrated sulfuric acid with a mass fraction of 98% and concentrated nitric acid with a mass fraction of 65% and potassium permanganate according to the mass ratio 3:0.85:0.15, the amount of carbon nanotubes added is 1.3g per 100mL mixed acid solution.

[0046] (2) The acidified carbon nanotubes were added to the activation solution, ultrasonically treated for 30 min, and placed in a water bath at 40° C. for 24...

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Abstract

The invention discloses a compound conductive adhesive for electronic packaging and a preparation method thereof, wherein the compound conductive adhesive for electronic packaging comprises the following materials by mass percent: 25-30% of resin matrix, 68-79.5% of silver powder and 0.5-2% of activated carbon nano tube. The preparation method comprises the steps of adding the carbon nano tube in mixed acid solution and carrying out ultrasonic treatment to obtain suspension mixed liquor, carrying out heating reflux on the suspension mixed liquor, diluting the suspension mixed liquor by using deionized water, carrying out vacuum filtration and washing to neutral so as to obtain a separated carbon nano tube, placing the separated carbon nano tube in watch glass for drying so as to obtain an acidized carbon nano tube, adding the acidized carbon nano tube in activate fluid of thiourea and N,N-dicyclohexylcarbodiimide for ultrasonic treatment, placing the ultrasonically treated carbon nano tube in a water bath for reaction so as to obtain an activated carbon nano tube, proportionally mixing the activated carbon nano tube with silver powder and the resin matrix, and grinding to obtain the compound conductive adhesive for electronic packaging.

Description

technical field [0001] The invention relates to a conductive adhesive, in particular to a composite conductive adhesive for electronic packaging prepared by two composite fillers of carbon nanotubes and flaky silver powder and a preparation method thereof. Background technique [0002] Electrically conductive adhesive is a special adhesive with conductive function. In recent years, with the gradual development of electronic components in the direction of miniaturization and portability, the tin-lead solder traditionally used in the electronic packaging industry has gradually become difficult to meet the requirements. Lead in tin-lead solder is extremely harmful to the human body and the environment, and countries have promulgated corresponding laws and regulations to restrict the use of lead-containing electronic products. As a high-performance packaging material, conductive adhesive has attracted people's attention. At present, it has replaced tin-lead solder in some elect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02
Inventor 王周成徐迅吴正涛
Owner XIAMEN UNIV
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