Preparation method for high-temperature-resisting epoxy organic silicon pouring sealant
An epoxy silicone, potting glue technology, applied in the direction of adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problems of high heat resistance, good adhesion, good toughness and so on , to achieve the effect of excellent heat resistance and adhesion performance, good wettability and low viscosity
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specific Embodiment approach 1
[0016] Specific implementation mode 1: This implementation mode is a high-temperature resistant epoxy silicone potting glue consisting of 100-150 parts of epoxy silicone resin, 10-55 parts of active silicone filler, 25-70 parts It is prepared from 1 part of curing agent, 1 part to 3 parts of curing accelerator, 10 parts to 50 parts of diluent and 0.5 part to 3 parts of defoamer.
[0017] Advantages of this embodiment: 1. This embodiment provides a preparation method for epoxy silicone resin and active silicone filler, and the prepared epoxy silicone resin and active silicone filler are used as raw materials of this embodiment. The prepared epoxy silicone potting adhesive has low viscosity and good wettability. The cured product has both toughness and heat resistance, and the quality of the potting parts is stable. The initial decomposition temperature of this embodiment is 393°C to 410°C. The shear strength at ℃ is 23MPa~26MPa; 2. In this embodiment, the high heat resistance o...
specific Embodiment approach 2
[0019] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the epoxy silicone resin is prepared according to the following steps:
[0020] Weigh 30 to 80 parts of organic silicon source, 10 to 40 parts of water, 20 to 100 parts of epoxy resin and 40 to 80 parts of solvent in parts by weight; first mix 30 to 80 parts of organic silicon source and 10 Mix 1 to 40 parts of water, react at a temperature of 50°C to 100°C for 1h to 5h to obtain a mixed solution, and then remove the water and produced Alcohols, then add 20-100 parts of epoxy resin and 40-80 parts of solvent, react at a temperature of 60°C-100°C for 2h-4h, and distill under reduced pressure to remove the solvent to obtain epoxy silicone resin; Wherein, the organosilicon source is composed of γ-aminopropyltriethoxysilane and organosilicon monomer mixture; the organosilicon monomer mixture is dimethyldiethoxysilane, methyltriethoxy ylsilane, methyltriacetoxysilane, γ-glycidylo...
specific Embodiment approach 3
[0021] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the active silicone filler is specifically prepared according to the following steps:
[0022] Weigh 30-80 parts of organic silicon source, 10-40 parts of water and 5-20 parts of ethyl orthosilicate in parts by weight; weigh 30-80 parts of organic silicon source and 10-40 Mix parts of water, react at a temperature of 50°C to 100°C for 1h to 5h, cool naturally to 30°C to 60°C, and then add 5 to 20 parts of ethyl orthosilicate dropwise to obtain a gel; ℃~30℃ for 10h~20h to obtain active silicone filler; wherein, the organic silicon source is composed of γ-aminopropyltriethoxysilane and organic silicon monomer mixture; the organic silicon monomer The solid mixture is dimethyldiethoxysilane, methyltriethoxysilane, methyltriacetoxysilane, γ-glycidyl etheroxypropyltrimethoxysilane, γ-methacryloxypropyl One or a mixture of trimethoxysilane, vinyltriethoxysilane, diphenyldiethoxysilane and methy...
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