A kind of polyimide insulating cardboard and preparation method thereof
A technology of polyimide paper and polyimide, applied in the direction of insulators, organic insulators, chemical instruments and methods, etc., can solve the problem that the ultra-thick insulating cardboard cannot be resistant to high temperature, has high hygroscopicity, and the performance of the cardboard is vulnerable to weather Conditional influence and other problems, to avoid excessive heating time, low hygroscopicity, and reduce secondary pollution
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0030] Such as figure 1 Shown, a kind of preparation method of polyimide insulating cardboard is prepared as follows:
[0031] 1) The semi-finished polyimide paper is prepared according to the following steps:
[0032] a) Using polyamic acid chopped fibers as raw materials, dispersing the raw materials in water to obtain a slurry;
[0033] b) After papermaking, pressing and drying the slurry obtained in step a), polyamic acid fiber paper is obtained;
[0034] c) Imidizing the polyamic acid fiber paper obtained in step b) to obtain a semi-finished polyimide paper. The temperature of the imidization treatment is 100°C.
[0035] 2) Laminate multiple layers of semi-finished polyimide paper to prepare polyimide cardboard; in the process of laminating polyimide semi-finished paper, two laminations are required, as follows: Put the semi-finished polyimide paper into the molding machine. Control the pressure of the molding machine to 10Mpa and the temperature to 150°C. After hot p...
Embodiment 2
[0040] The characteristics of this embodiment are:
[0041] In step 1), polyimide fibers and polyamic acid chopped fibers are mixed in a ratio of 1:1 to make polyimide paper, and the processing temperature of polyimide paper is 150°C.
[0042] In step 2), put 50 sheets of polyimide paper into the molding machine with a pressure of 10Mpa, a temperature of 200°C, hot pressing for 100min, and deflation for 5min. Put the semi-finished cardboard into the molding machine again, the pressure is 20Mpa, the temperature is 350°C, and it is hot-pressed for 1h. Take out the semi-finished cardboard and put it in a constant temperature and humidity storage for 30 hours.
[0043] A cardboard with a thickness of 10 mm is produced.
[0044] Others are the same as in Example 1.
[0045] After inspection, the weight of the cardboard is 1000g / m 2 , thickness 5mm, longitudinal tensile strength 621N / mm, transverse tensile strength 434N / mm; dielectric strength in air 35kv / mm, dielectric strength...
Embodiment 3
[0047] The characteristics of this embodiment are:
[0048] In step 1), polyimide fibers and polyamic acid chopped fibers are mixed in a ratio of 4:1 to make polyimide paper, and the processing temperature of polyimide paper is 100°C.
[0049] In step 2), put 80 sheets of polyimide paper into the molding machine with a pressure of 15Mpa, a temperature of 200°C, hot pressing for 100 minutes, and degassing for 5 minutes. Put the semi-finished cardboard into the molding machine again, press 25Mpa, temperature 400°C, and hot press for 2h. Take out the semi-finished cardboard and put it in a constant temperature and humidity storage for 48 hours.
[0050] A cardboard with a thickness of 20 mm is produced.
[0051] Others are the same as in Example 1.
[0052] After inspection, the weight of the cardboard is 1300g / m 2 ,Thickness 8mm, longitudinal tensile strength 811N / mm, transverse tensile strength 641N / mm; dielectric strength in air 46kv / mm, dielectric strength in insulating o...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| Basis weight | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More