A method of fabricating an optical fiber alignment base array on a silicon-based process

Abstract

The invention discloses a method for manufacturing optical fiber alignment base arrays on the basis of a silicon-based process. The method comprises the steps of 1.1 drawing through hole arrays and sizes required by optical fiber alignment base arrays on a photolithography mask; 1.2 defining the through hole arrays and sizes on the photolithography mask on a silicon wafer through photoresist; 1.3 etching the through holes of the optical fiber alignment base arrays through a dry etching machine; 1.4 removing remaining photoresist through a photoresist removal machine; 1.5 removing etching reaction polymers produced during dry etching. According to the method, the silicon-based semiconductor manufacture process is used; the method has the advantages of being high in production efficiency, small in volume, high in yield, mature in process, strict in monitoring and capable of manufacturing optical fiber alignment bases which are economic, high in accuracy and capable of being produced in quantity.

Description

technical field [0001] The invention belongs to the manufacturing process of semiconductor integrated circuits, and relates to a method for manufacturing an optical fiber alignment base array on a silicon-based process. Background technique [0002] At present, the application of optical communication devices is becoming more and more extensive, and fiber-to-the-home projects have also begun to be gradually implemented in economically developed areas. In an optical system, multiple optical fiber channels are required for optical signal processing, and long and thin optical fibers need to be fixed on a large number of optical fiber alignment bases (OFAs) to ensure that the quality of the fixed optical fiber meets the system requirements. Therefore, high alignment accuracy and stable process are the basic requirements for low optical signal power loss. [0003] At present, the most commonly used method in the industry is to use laser melting glass to make fiber through-hole b...

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Problems solved by technology

[0003] At present, the most commonly used method in the industry is to use laser melting glass to make fiber through-hole bases. The laser melting method has the disadvantages of rough manufacturing process, low alignment accuracy, high cost and low efficiency, and poor alignment of optical fibers leads to poor optical signal power. The problem of serious loss, so there is an urgent need for a high-precision, low-cost and high-yield manufacturing process to replace it

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