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Cobalt-containing low-silver cadmium-free silver solder

A silver solder, mass percentage technology, used in welding/cutting media/materials, welding media, metal processing equipment, etc., to achieve good fluidity, high solder joint strength, and good wettability.

Active Publication Date: 2014-06-11
ZHEJIANG GLOBAL JOINING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the silver content of the low-silver and cadmium-free silver solders disclosed in these documents is all in the range of 16.0% to 40%, and more specifically, they do not belong to the low-silver non-silver solder with a silver content of about 15% and a solder melting point close to BAg20CuZnCd. Cadmium silver solder, therefore, cannot replace BAg20CuZnCd solder "under the condition of not changing the existing production process"

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A cobalt-containing low-silver and cadmium-free silver brazing filler metal, the ratio by mass percentage is: 16% Ag, 41% Cu, 1% In, 0.5% Ga, 0.01% Co, and the balance is Zn. The solidus temperature of the "cobalt-containing new low-silver and cadmium-free silver solder" obtained from the above composition ratio is 655°C ± 10°C, and the liquidus temperature is 745°C ± 10°C (all considering the measurement error). During brazing, the solder has good fluidity and good wetting performance to the base metal.

[0024] Use the flame brazing method, cooperate with FB102 flux, and the brazing joint strength when the brazing base material is the following combination: see the data in the brackets: copper - brass (σ b =210±25MPa, τ=200±30MPa), copper-nickel-based alloy (σ b =210±25MPa, τ=200±30MPa), brass-nickel-based alloy (σ b =330±25MPa, τ=325±30MPa), brazing joint mechanics when brazing copper-brass, copper-nickel-based alloy, brass-nickel-based alloy with BAg20CuZnCd solder ...

Embodiment 2

[0026] A cobalt-containing low-silver and cadmium-free silver brazing filler metal, the ratio by mass percentage is: 12% Ag, 39% Cu, 8% In, 4% Ga, 1.2% Co, and the balance is Zn. The solidus temperature of the "cobalt-containing new low-silver and cadmium-free silver solder" obtained from the above composition ratio is 655°C ± 10°C, and the liquidus temperature is 745°C ± 10°C (all considering the measurement error). During brazing, the solder has good fluidity and good wetting performance to the base metal.

[0027] Use the flame brazing method, cooperate with FB102 flux, and the brazing joint strength when the brazing base material is the following combination: see the data in the brackets: copper - brass (σ b =210±25MPa, τ=200±30MPa), copper-nickel-based alloy (σ b =210±25MPa, τ=200±30MPa), brass-nickel-based alloy (σ b =330±25MPa, τ=325±30MPa), brazing joint mechanics when brazing copper-brass, copper-nickel-based alloy, brass-nickel-based alloy with BAg20CuZnCd solder a...

Embodiment 3

[0029] A cobalt-containing low-silver and cadmium-free silver brazing filler metal, the ratio by mass percentage is: 13% Ag, 40% Cu, 2% In, 1% Ga, 0.2% Co, and the balance is Zn. The solidus temperature of the "cobalt-containing new low-silver and cadmium-free silver solder" obtained from the above composition ratio is 655°C ± 10°C, and the liquidus temperature is 745°C ± 10°C (all considering the measurement error). During brazing, the solder has good fluidity and good wetting performance to the base metal.

[0030] Use the flame brazing method, cooperate with FB102 flux, and the brazing joint strength when the brazing base material is the following combination: see the data in the brackets: copper - brass (σ b =210±25MPa, τ=200±30MPa), copper-nickel-based alloy (σ b =210±25MPa, τ=200±30MPa), brass-nickel-based alloy (σ b =330±25MPa, τ=325±30MPa), brazing joint mechanics when brazing copper-brass, copper-nickel-based alloy, brass-nickel-based alloy with BAg20CuZnCd solder a...

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Abstract

The invention belongs to metal materials, in particular to a cobalt-containing low-silver cadmium-free silver solder. The cobalt-containing low-silver cadmium-free silver solder is characterized by comprising the following components in percentage by mass: 12 to 16 percent of Ag, 39 to 41 percent of Cu, 1 to 8 percent of In, 0.5 to 4 percent of Ga, 0.01 to 1.2 percent of Co, and the balance of Zn, wherein In:Ga=2:1. The cobalt-containing low-silver cadmium-free silver solder obtained by the component proportion has the characteristics of high fluidity, high wettability, high welding spot strength and the like, has the melting temperature range close to that of the Bag20CuZnCd solder, and is particularly suitable for soldering some products in household electrical appliance industry and hardware product industry; the problems of workpiece oxidization, reduction of soldering joint strength and the like caused by over-high soldering temperature are avoided.

Description

technical field [0001] The invention belongs to the technical field of brazing materials of metal materials, and in particular relates to a cobalt-containing low-silver and cadmium-free silver solder. Background technique [0002] Among brazing materials, BAg20CuZnCd brazing filler metal, which is commonly used at present, has excellent brazing performance when combined with flux (such as FB102 flux) due to its chemical composition containing Cd element, but it cannot meet the requirements of the EU RoHS directive. Other silver solders have a variety of cadmium-free formulations, but due to their high silver content, they cannot meet the needs of market competition in the home appliance industry and hardware products industry. It is urgent to develop silver solder with a silver content of about 15% to reduce Cost of production. [0003] The applicant has carried out literature search, although see the technical information of low-silver cadmium-free silver brazing filler me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24
CPCB23K35/302
Inventor 张伟平
Owner ZHEJIANG GLOBAL JOINING TECH
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