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Resin composition and its preparation method and application

A technology of resin composition and epoxy resin, which is applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problems of endangering the health of builders or users, and achieve excellent bonding performance and long service life. prolonged effect

Inactive Publication Date: 2016-01-20
漳州市奈特新型建材有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, solvents or diluents must be added to high-viscosity epoxy resins to facilitate processing, but solvents or diluents are harmful to the human body and may be released during processing, endangering the health of builders or users. Industry Begins to Emphasize Solvent-Free and Waterborne Epoxy Resins

Method used

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  • Resin composition and its preparation method and application
  • Resin composition and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Prepare the resin composition according to the following formula and steps, and apply it as a stone adhesive:

[0026] (1) Preparation of liquid A:

[0027] Mix 100 parts by weight of water-based bisphenol A epoxy resin E51 and 100 parts by weight of non-aqueous epoxy resin E51 evenly, and then add 10 parts by weight of auxiliary agent (allyl glycidyl ether) to prepare liquid A .

[0028] Wherein, the auxiliary agent can also be one or a combination of various types of leveling agents, defoamers, coupling agents and reactive diluents available on the market. For example, the leveling agent can be BYK-306, BYK-333, BYK-323, BYK-358N, BYK-354 etc. of BYK, Germany, Flow300, Glide410, Glide435 of Digaosha (TEGO) company, Glide450, Glide432, WetKL245 etc.; Defoamer can be BYK-141, BYK-052, BYK-066N, BYK-023 of German BYK (BYK) company, FoamexN, Foamex815N, Foamex825 of Digaosha (TEGO) company, Foamex840, Foamex842, etc.; the coupling agent can be American Dow Corning silane...

Embodiment 2

[0036] The present embodiment is substantially the same as Example 1, and the adjustment of its formula is as in Table 1.

[0037] The use time of the resin composition:

[0038] After the resin composition is placed for 30 minutes, the viscosity does not change significantly, that is, the usable time after compounding is greater than 30 minutes.

[0039] Application of resin composition in stone bonding:

[0040] Coat the resin composition on two pieces of stone and bond them accordingly. Cut the stone after 10 days, and the bonded part does not come off; use a hammer to destructively hammer the cut surface of the bonded part of the stone, and the stone is broken as a whole, but The bonded parts of the stone are not detached.

Embodiment 3

[0042] The present embodiment is substantially the same as Example 1, and the adjustment of its formula is as in Table 1.

[0043] And the components of the water-based epoxy resin are as follows: by mass ratio, it includes the following components: bisphenol A epoxy resin E51100 parts; water-soluble radical initiator potassium persulfate 1-30 parts; monomer styrene and acrylonitrile 0-20 parts; water-soluble hardener triethanolamine and ethylenediamine 1-50 parts; phase transfer catalyst crown ether 0.1-5 parts and water 100-200 parts.

[0044] The use time of the resin composition:

[0045] After the resin composition is placed for 30 minutes, the viscosity does not change significantly, that is, the usable time after compounding is greater than 30 minutes.

[0046] Application of resin composition in stone bonding:

[0047] Coat the resin composition on two pieces of stone and bond them accordingly. Cut the stone after 10 days, and the bonded part does not come off; use a...

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Abstract

The invention discloses a resin composition as well as a preparation method and application thereof. The resin composition comprises following components in parts by weight: 10-120 parts of aqueous bisphenol A resin, 10-200 parts of non-aqueous epoxy resin, 6-20 parts of amide curing agent and 20-2000 parts of water and / or emulsion. The resin composition takes aqueous epoxy resin and the non-aqueous epoxy resin as main body resin and the amide curing agent is used for carrying out a cross-linking reaction, so that the resin composition is especially suitable for bonding stone materials and bonding the stone materials with metal; the resin composition does not contain a toxic volatile solvent, the effective service life is prolonged and the bonding performance is good.

Description

technical field [0001] The invention discloses a resin composition, especially a resin composition used as an adhesive. Background technique [0002] Stone materials have been used for a very long time in human history, and the technology related to stone materials has been continuously improved for thousands of years. Since stone is generally not plastic, to process stone into a specific shape, the stone must be carved, cut and bonded. Among them, cutting the stone and bonding it into a specific material shape is one of the most economical stone processing methods. The stone binder must have high bond strength, water resistance and workability. The currently commercially available stone binders mainly include polyurethane, unsaturated polyester, and epoxy resin. [0003] Epoxy resin has high strength, waterproof, and easy to use, so it is widely used in the field of building material adhesives. For example, the patent CN101974304A discloses a vinyl ester resin stone adh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/06C09J11/08
Inventor 阮韶铭林镇辉张苏伟
Owner 漳州市奈特新型建材有限责任公司