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Modified moisture-curable polyurethane hot melt adhesive and preparation method thereof

A polyurethane hot-melt adhesive, moisture curing technology, applied in the direction of polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve problems such as poor bonding effect, and achieve the effect of broadening the application field and development space

Pending Publication Date: 2019-09-27
南通天洋新材料有限公司 +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the ester bond and urethane bond in the polyurethane molecular chain are polar groups, the bonding effect on polar materials is better, but the bonding effect on non-polar or weak polar materials is poor.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A modified moisture-curing polyurethane hot-melt adhesive, its raw material composition, in parts by mass, includes: 47.45 parts of polypropylene glycol, 10 parts of polyethylene glycol phthalate diol, polybutylene adipate 20 parts of ester diol, 2.5 parts of reactive polyolefin hot melt adhesive (brand SikaMelt®-9184), 20 parts of 4,4'-diphenylmethane diisocyanate, 0.05 parts of bis(2,2-morpholine ethyl) ether share.

[0024] The preparation method of above-mentioned modified moisture curing polyurethane hot-melt adhesive, the steps are as follows:

[0025] (1) Select raw materials with reference to the composition of the above raw materials;

[0026] (2) Add polypropylene glycol, polyethylene phthalate diol, and polybutylene adipate diol into the reaction kettle, stir and mix evenly, heat up to 120°C~130°C, and Under the condition of vacuum <100Pa, dehydration for 1h;

[0027] (3) Add reactive polyolefin hot melt adhesive, heat up to 140°C, and stir and melt for 1 ...

Embodiment 2

[0033] A modified moisture-curing polyurethane hot-melt adhesive, its raw material composition, in parts by mass, includes: 30 parts of polypropylene glycol, 10 parts of polytrimethylene phthalate diol, polybutylene adipate diol 29.95 parts, 5 parts of non-reactive polyolefin hot melt adhesive (brand SikaMelt®-9171), 25 parts of 4,4'-diphenylmethane diisocyanate, 0.05 parts of bis(2,2-morpholine ethyl) ether.

[0034] The preparation method of above-mentioned modified moisture curing polyurethane hot-melt adhesive, the steps are as follows:

[0035] (1) Select raw materials with reference to the composition of the above raw materials;

[0036] (2) Add polypropylene glycol, polytrimethylene phthalate diol, and polybutylene adipate diol into the reaction kettle, stir and mix evenly, heat up to 120°C~130°C, and vacuum < Under the condition of 100Pa, dehydration for 1h;

[0037] (3) Add non-reactive polyolefin hot melt adhesive, heat up to 140°C, and stir and melt for 1 hour und...

Embodiment 3

[0043] A method for preparing a modified moisture-curing polyurethane hot-melt adhesive, the composition of raw materials, in parts by mass, includes: 32.4 parts of polypropylene glycol, 20 parts of polyethylene glycol phthalate diol, polyadipic acid 20 parts of butanediol ester diol, 2.5 parts of non-reactive polyolefin hot melt adhesive, 25 parts of 4,4'-diphenylmethane diisocyanate, and 0.1 part of bis(2,2-morpholine ethyl) ether.

[0044] The preparation method of above-mentioned modified moisture curing polyurethane hot-melt adhesive, the steps are as follows:

[0045] (1) Select raw materials with reference to the composition of the above raw materials;

[0046] (2) Add polypropylene glycol, polyethylene phthalate diol, and polybutylene adipate diol into the reaction kettle, stir and mix evenly, heat up to 120°C~130°C, and Under the condition of vacuum <100Pa, dehydration for 1h;

[0047] (3) Add reactive polyolefin hot melt adhesive polymer, heat up to 140°C, and stir...

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PUM

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Abstract

The invention discloses a modified moisture-curable polyurethane hot melt adhesive and a preparation method thereof, especially a moisture-curable polyurethane hot melt adhesive suitable for bonding of unpretreated non-polar and weakly polar non-stick materials such as PP, and a preparation method thereof. The modified moisture-curable polyurethane hot melt adhesive is composed of the following raw materials (by mass): 30-47.45 parts of polyether polyol, 10-20 parts of o-phenyl polyester polyol, 20-30 parts of adipic acid polyester polyol, 2.5-5 parts of a polyolefin hot melt adhesive polymer, 20-25 parts of 4,4'-diphenylmethane diisocyanate, and 0.05-0.1 part of catalyst. The reactive moisture-curable polyurethane hot melt adhesive prepared according to the invention is suitable for bonding of polar materials, has good intermiscibility with unpretreated non-polar or weakly polar non-stick materials such as PP, and is also suitable for direct bonding of those non-stick materials.

Description

technical field [0001] The invention relates to a modified moisture-curing polyurethane hot-melt adhesive and a preparation method thereof, in particular to a moisture-curing polyurethane hot-melt adhesive suitable for bonding non-polar and weakly polar difficult-to-bond materials such as PP without pretreatment. Melt glue and its preparation method. Background technique [0002] Moisture-curing polyurethane hot melt adhesive (hereinafter referred to as PUR) is a type of polyurethane adhesive containing terminal-NCO groups. When in use, heat, melt and sizing, and after the adhesive layer is cooled and physically solidified to produce preliminary adhesive force, the terminal NCO in the adhesive layer will react with the moisture in the air or the active hydrogen compound on the surface of the adherend to produce chemical crosslinking solidified. Moisture-curing polyurethane hot-melt adhesive not only has the advantages of fast bonding and positioning of traditional thermopl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/48C08G18/42C08G18/62C09J175/08
CPCC08G18/4063C08G18/4202C08G18/48C08G18/6204C09J175/08
Inventor 肖虎鹏郑仁峰
Owner 南通天洋新材料有限公司
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