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A kind of anti-yellowing photosensitive solder resist ink and preparation method thereof

A photosensitive solder resist ink, anti-yellowing technology, applied in ink, optical mechanical equipment, optics, etc., can solve the core technology in the hands of foreigners, can not meet the requirements of LED use, chemical resistance, heat resistance and other problems , achieve good UV curing performance, solve the effect of high temperature yellowing and high gloss

Active Publication Date: 2016-06-01
恒昌涂料(惠阳)有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is a fatal problem in the development of domestic photosensitive solder resist ink for LED: the core technology is still in the hands of foreigners
At present, the traditional photosensitive solder resist ink for LED produced in China has average whiteness, poor chemical resistance and heat resistance, and cannot meet the use requirements of LED at all.

Method used

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  • A kind of anti-yellowing photosensitive solder resist ink and preparation method thereof
  • A kind of anti-yellowing photosensitive solder resist ink and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] With 150gβ-hydroxyethyl acrylate modified melamine formaldehyde resin, 5g polysilazane resin, 118g titanium dioxide, 5g octadecylamine acetate dispersant, 5gTEPO photoinitiator, 5g1173 photoinitiator, 10g fumed silica, Mix 2g of ultramarine blue evenly, use a high-speed disperser, adjust the speed to 1100rpm, stir and disperse for 30min, and then grind 5 times with a three-roller machine until the fineness is below 20μm to obtain the main ingredient.

[0033] Mix 50g trimethylolpropane triacrylate, 50g pentaerythritol tetraacrylate, 80g titanium dioxide, and 50g epoxy resin evenly, use a high-speed disperser, adjust the speed to 1100rpm, stir and disperse for 30min, and then grind 5 times with a three-roller machine , until the fineness is below 20 μm, the curing agent is prepared.

[0034] The main agent and the curing agent are mixed according to the ratio of 6:1, 5g of silicone defoamer is added, stirred and dispersed evenly, and the anti-yellowing photosensitive sol...

Embodiment 2

[0046] With 100gβ-hydroxyethyl acrylate modified melamine formaldehyde resin, 10g polysilazane resin, 100g titanium dioxide, 3g octadecylamine acetate dispersant, 3gTEPO photoinitiator, 3g1173 photoinitiator, 6g talcum powder, 1.5g Mix ultramarine blue evenly, use a high-speed disperser, adjust the speed to 1100 rpm, stir and disperse for 30 minutes, and then use a three-roll machine to grind 5 times until the fineness is below 20 μm to obtain the main ingredient.

[0047]Mix 30g trimethylolpropane triacrylate, 40g pentaerythritol tetraacrylate, 60g titanium dioxide, and 40g epoxy resin evenly, use a high-speed disperser, adjust the speed to 1100rpm, stir and disperse for 30min, and then grind 5 times with a three-roller machine , until the fineness is below 20 μm, the curing agent is prepared.

[0048] Mix the main agent and the curing agent in a ratio of 4:1, add 4g of silicone defoamer, stir and disperse evenly, and then the anti-yellowing photosensitive solder resist ink f...

Embodiment 3

[0060] Mix 50gβ-hydroxyethyl acrylate modified melamine formaldehyde resin, 15g polysilazane resin, 79g titanium dioxide, 2g octadecenamine acetate dispersant, 2gTEPO photoinitiator, 2g1173 photoinitiator, 4g kaolin, 1g ultramarine blue Evenly, use a high-speed disperser, adjust the speed to 1100rpm, stir and disperse for 30 minutes, and then use a three-roller to grind 5 times until the fineness is below 20μm to obtain the main ingredient.

[0061] Mix 15g trimethylolpropane triacrylate, 20g pentaerythritol tetraacrylate, 40g titanium dioxide, and 15g epoxy resin evenly, use a high-speed disperser, adjust the speed to 1100rpm, stir and disperse for 30min, and then grind 5 times with a three-roller machine , until the fineness is below 20 μm, the curing agent is prepared.

[0062] Mix the main agent and the curing agent in a ratio of 2:1, add 2g of silicone defoamer, stir and disperse evenly, and then the anti-yellowing photosensitive solder resist ink for LEDs of the present ...

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Abstract

The invention relates to the field of ink and particularly relates to yellowing-resistant photosensitive solder resist ink and a preparation method thereof. The yellowing-resistant photosensitive solder resist ink is prepared from the following components in parts by mass: 50-150 parts of beta-hydroxyethyl acrylate modified melamine-formaldehyde resin, 40-120 parts of reaction diluent, 5-15 parts of polysilazane resin, 15-50 parts of epoxy resin, 4-12 parts of photoinitiator, 120-200 parts of pigment, 4-10 parts of filler and 4-10 parts of auxiliary. The invention provides yellowing-resistant photosensitive solder resist ink for an LED (Light Emitting Diode); compared with the traditional home-produced photosensitive solder resist ink, the solder resist ink prepared by the invention has the advantages of high reflectance and excellent heat resistance, soldering resistance and yellowing resistance, and is particularly suitable for being used as photosensitive solder resist ink for the LED.

Description

technical field [0001] The invention relates to the field of inks, in particular to an anti-yellowing photosensitive solder resist ink and a preparation method thereof. Background technique [0002] At present, China's LED market demand has reached 87.57 billion. In the next three to five years, the market's demand for LEDs will continue to grow. It is estimated that by 2015, China's LED market demand will reach 192.74 billion, and the market size will reach 40.67 billion yuan; from 2013 to 2015, the average annual compound growth rate of China's LED market will reach 14.3%. The growth of the LED market will continue to expand the demand for liquid photosensitive solder resist inks for LEDs. [0003] The substrate used to install LEDs is also called aluminum substrate, which is a metal-based copper clad laminate with good heat dissipation function. It consists of a unique three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base lay...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/101C09D11/102G03F7/075
Inventor 万彬凌远龙王小妹陈忠君杨爱军王德模
Owner 恒昌涂料(惠阳)有限公司