Method for welding LED chip to ceramic body through ultrasonic waves at normal temperature

A LED chip and ultrasonic welding technology, which is applied in the manufacture of semiconductor devices, electric solid devices, semiconductor/solid devices, etc., can solve problems such as chip damage, impact on chip life, damage, etc., and achieve extended chip life, high practical value, and reduced There is the effect of lead pollution

Inactive Publication Date: 2014-07-02
ZHEJIANG JINGDA QITAI TECH +1
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

If the current commonly used reflow soldering or wave soldering is used, the soldering temperature exceeds 200 degrees, and the temperature exceeds 100 degrees for at least a few minutes, which will cause certain damage to various integrated circuits and LED chi

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  • Method for welding LED chip to ceramic body through ultrasonic waves at normal temperature
  • Method for welding LED chip to ceramic body through ultrasonic waves at normal temperature

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Embodiment Construction

[0016] The purpose and effects of the present invention will become more apparent by describing the present invention in detail below in conjunction with the accompanying drawings and embodiments.

[0017] The method for normal-temperature ultrasonic welding of LED chips on a ceramic body of the present invention comprises the following steps:

[0018] (1) Sintering palladium silver on the ceramic body 1 to form the soldering silver pad 2 and the thermally conductive silver pad 3, this step includes the following sub-steps:

[0019] (1.1) Screen printing: First, make templates for thermally conductive silver pads 2 and soldered silver pads 3, apply photosensitive glue on the screen, then put the template on the photosensitive glue, expose it through an exposure machine, and cover it with the template on the screen Exposure outside the part, the photosensitive glue is solidified, and the part covered by the template is opaque, and the photosensitive glue covered by the template...

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Abstract

The invention discloses a method for welding an LED chip to a ceramic body through ultrasonic waves at a normal temperature. The method includes the steps of conducting screen printing on the ceramic body through silver palladium alloy slurry by means of a template, sending the ceramic body into a ceramic sintering furnace to be sintered at a high temperature so that a welding disc circuit formed by the silver palladium alloy slurry can be tightly combined with the ceramic body, welding a welding disc on the ceramic body to an electrode of the LED chip through the ultrasonic waves by means of alloy wires or gold wires so that current of a power supply can flow into the LED chip from the welding disc of the ceramic body through the alloy wires or the gold wires and enable the LED chip to work. Due to the fact that high-temperature tin soldering at the temperature of 200 DEG C or higher such as reflow soldering is avoided, the LED chip is protected, the service life of the LED chip is greatly prolonged, supports, printing plates and other materials are reduced, the processes such as the support arranging process, the reflow soldering process and the circuit printing process are reduced, and high practical value is achieved.

Description

technical field [0001] The invention relates to the technical field of welding processing of LED chips, in particular to a method for ultrasonically welding LED chips on a ceramic body at normal temperature. Background technique [0002] With the country's emphasis on energy saving, especially the rapid development of the LED industry, the life expectancy of LEDs is getting higher and higher, and the welding of LED chips on ceramic materials is very important, because ceramic materials not only meet the requirements of high thermal conductivity, Corrosion resistance, high temperature resistance, wear resistance, and meet the requirements of insulation and ultra-high frequency. However, LED chips are relatively delicate, and the operating temperature of the chip is generally civilian grade: 0~+70 degrees; industrial grade: -40~+85 degrees; automotive grade: -40~+125 degrees; military grade: -55~+125 degrees . If the current commonly used reflow soldering or wave soldering i...

Claims

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Application Information

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IPC IPC(8): H01L33/00
CPCH01L24/81H01L33/62H01L21/4867H01L2224/81101H01L2933/0066H01L2224/48091H01L2224/8592H01L2924/00014
Inventor 何永祥席科贾浩巍胡民花
Owner ZHEJIANG JINGDA QITAI TECH
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