Method for welding LED chip to ceramic body through ultrasonic waves at normal temperature

Abstract

The invention discloses a method for welding an LED chip to a ceramic body through ultrasonic waves at a normal temperature. The method includes the steps of conducting screen printing on the ceramic body through silver palladium alloy slurry by means of a template, sending the ceramic body into a ceramic sintering furnace to be sintered at a high temperature so that a welding disc circuit formed by the silver palladium alloy slurry can be tightly combined with the ceramic body, welding a welding disc on the ceramic body to an electrode of the LED chip through the ultrasonic waves by means of alloy wires or gold wires so that current of a power supply can flow into the LED chip from the welding disc of the ceramic body through the alloy wires or the gold wires and enable the LED chip to work. Due to the fact that high-temperature tin soldering at the temperature of 200 DEG C or higher such as reflow soldering is avoided, the LED chip is protected, the service life of the LED chip is greatly prolonged, supports, printing plates and other materials are reduced, the processes such as the support arranging process, the reflow soldering process and the circuit printing process are reduced, and high practical value is achieved.

Description

technical field [0001] The invention relates to the technical field of welding processing of LED chips, in particular to a method for ultrasonically welding LED chips on a ceramic body at normal temperature. Background technique [0002] With the country's emphasis on energy saving, especially the rapid development of the LED industry, the life expectancy of LEDs is getting higher and higher, and the welding of LED chips on ceramic materials is very important, because ceramic materials not only meet the requirements of high thermal conductivity, Corrosion resistance, high temperature resistance, wear resistance, and meet the requirements of insulation and ultra-high frequency. However, LED chips are relatively delicate, and the operating temperature of the chip is generally civilian grade: 0~+70 degrees; industrial grade: -40~+85 degrees; automotive grade: -40~+125 degrees; military grade: -55~+125 degrees . If the current commonly used reflow soldering or wave soldering i...

AI Technical Summary

Problems solved by technology

If the current commonly used reflow soldering or wave soldering is used, the soldering temperature exceeds 200 degrees, and the temperature exceeds 100 degrees for at least a few minutes, which will cause certain damage to various integrated circuits and LED chips, and the damage will affect the life of the chip. If it is serious, it will be scrapped directly; and the common soldering method requires chip brackets and a large amount of soldering materials, as well as packaging, printing and reflow soldering processes.

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