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Cadmium-free low-silver solder containing tin, manganese and indium

A technology of silver brazing material and content, applied in welding/cutting medium/material, welding medium, metal processing equipment, etc., can solve the problems of high silver content of precious metal, low silver content and toxic element cadmium, etc.

Inactive Publication Date: 2014-07-09
JINHUA SANHUAN WELDING MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a kind of silver solder with good overall performance, cadmium-free and low silver content to solve the problem that the noble metal silver content is too high and the toxic element cadmium is contained in the traditional silver solder.

Method used

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  • Cadmium-free low-silver solder containing tin, manganese and indium
  • Cadmium-free low-silver solder containing tin, manganese and indium
  • Cadmium-free low-silver solder containing tin, manganese and indium

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Embodiment 1

[0013]

Embodiment 2

[0015]

Embodiment 3

[0017]

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PUM

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Abstract

The invention belongs to welding materials, and particularly relates to cadmium-free low-silver solder containing tin, manganese and indium. The solder is characterized by comprising, by mass, 24-26% of silver, 32-34% of zinc, 0.9-1.5% of tin, 0.8-1.8% of manganese, 1.0-1.6% of indium and the balance copper. Through the optimized elementary compositions, mechanical property of the silver solder can be improved, liquidus and solidus temperature is lowered, wettability and flowability of the solder are improved, overall performance of the solder shows that the solder is enough to replace conventional silver solder B-Ag35CuZn, content of the precious metal Ag is lowered, production cost of the solder is effectively lowered to the benefit of popularization and application, and good economic benefit is produced.

Description

technical field [0001] The invention belongs to the category of welding materials, in particular to a cadmium-free and low-silver solder containing tin, manganese and indium. Background technique [0002] The traditional medium-temperature silver material is Ag-Cu-Zn-Cd solder alloy. With the promulgation of the RoHS directive and the No. 39 order of seven ministries and commissions including the Ministry of Information Industry of my country, cadmium is restricted to be used in solder. Solder researchers try to achieve cadmium-free by looking for substitutes for cadmium, but these solder systems are still comparable to traditional cadmium-containing silver solders in terms of price, brazing process performance, or processing performance. A certain gap. To obtain the same performance as the traditional cadmium-containing solder, it is usually necessary to increase the content of silver and other precious metals. [0003] Silver solder is mainly based on Ag-Cu-Zn alloy, sup...

Claims

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Application Information

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IPC IPC(8): B23K35/30
CPCB23K35/302
Inventor 张玉海
Owner JINHUA SANHUAN WELDING MATERIALS
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