Abrasive grain saw blade and saw machine for dissociating abrasive cutting

A technology of free abrasives and abrasive grains, applied in the direction of fine working devices, working accessories, stone processing equipment, etc., can solve the problems of ineffective cutting of workpieces, reduced cutting line strength, and low cutting efficiency, so as to reduce daily consumption, The effect of reducing the cost of daily consumption and improving the utilization rate

Inactive Publication Date: 2014-07-09
王金生 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Cutting by cutting wire needs to make the diameter of the cutting wire very small, which will reduce the strength of the cutting wire, and it is easy to break when running at high speed
Ordinary saw blades are used, such as a saw blade [CN2567016Y] disclosed in Chinese patent literature. This type of saw blade mainly wears the workpiece through the direct contact of the saw teeth. When the free abrasive cutting method is used, this type of saw blade cannot effectively drive the abrasive. Contact with the workpiece, the workpiece cannot be effectively cut, and the cutting efficiency is low

Method used

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  • Abrasive grain saw blade and saw machine for dissociating abrasive cutting
  • Abrasive grain saw blade and saw machine for dissociating abrasive cutting
  • Abrasive grain saw blade and saw machine for dissociating abrasive cutting

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] An abrasive saw blade for free abrasive cutting, such as figure 1 As shown, the cross-section of the abrasive saw blade 1 is circular, the center of the abrasive saw blade 1 has a fixing hole 2, and the outer peripheral surface of the abrasive saw blade 1 has a number of throwing notches 3 capable of accommodating free abrasive grains 41. The material rejection notches 3 are evenly distributed circumferentially on the outer peripheral surface of the abrasive grain saw blade 1, the center line of the material rejection notches 3 passes through the center of the fixing hole 2, and the material rejection notches 3 are symmetrical along the center line.

[0028] The opening of getting rid of material notch 3 has radian a, in the present embodiment one, as figure 1 As shown, the size of the radian a is π / 18, there are 18 material rejection notches 3, the thickness of the abrasive saw blade 1 is 0.02mm, the depth of the material rejection notch is b, and the radius of the abr...

Embodiment 2

[0036] The structure and principle of this embodiment are basically the same as that of the first embodiment, except that the radian a has a size of π / 144, 144 material rejection notches, and the thickness of the abrasive saw blade is 0.2 mm.

Embodiment 3

[0038] The structure and principle of this embodiment are basically the same as that of Embodiment 1, except that the radian a has a size of π / 81, 81 material rejection notches, and the thickness of the abrasive saw blade is 0.1 mm.

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Abstract

The invention provides an abrasive grain saw blade and saw machine for dissociating abrasive cutting, and belongs to the technical field of material cutting. According to the abrasive grain saw blade, the technical problem that when the dissociating abrasive cutting mode is adopted, a common saw blade cannot effectively drive abrasive materials to make contact with a workpiece is solved. According to the abrasive grain saw blade for dissociating abrasive cutting, the edge of an abrasive grain saw blade body is provided with a plurality of throwing notches capable of containing dissociating abrasive grains, the throwing notches are evenly distributed in the edge of the abrasive grain saw blade body in the circumferential direction, and the throwing notches are symmetrical about a centerline. The saw machine for dissociating abrasive cutting comprises a machine frame, the abrasive grain saw blade, a rotating shaft and a cutting plate used for placing a workpiece to be cut, wherein the cutting plate is arranged on the machine frame, the rotating shaft is in rotating connection with the machine frame, the abrasive grain saw blade is fixed on the rotating shaft, a material spraying pipe is fixed on the machine frame, the material spraying pipe is provided with a plurality of material nozzles facing the abrasive grain saw blade, and the cutting plate and the rotating shaft can move relative to each other. The abrasive grain saw blade and saw machine for dissociating abrasive cutting have the advantage that cutting efficiency is enhanced when the dissociating abrasive cutting mode is adopted.

Description

technical field [0001] The invention belongs to the technical field of material cutting, and relates to an abrasive saw blade and a sawing machine for free abrasive cutting. Background technique [0002] Free abrasive cutting is mainly used for cutting brittle and hard materials, such as crystal, sapphire, silicon and other materials. At present, free abrasive cutting is generally completed by cutting wire cutting. The principle is that the cutting wire passes through abrasives such as carbon carbide, diamond, The slurry of corundum and other abrasives drives the abrasive through the high-speed movement of the cutting wire, making the abrasive contact with the workpiece, and the workpiece is lost through the abrasive to complete the cutting. Cutting by cutting wire needs to make the diameter of the cutting wire very small, which will cause the strength of the cutting wire to decrease, and it is easy to break when running at high speed. Ordinary saw blades are used, such as ...

Claims

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Application Information

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IPC IPC(8): B28D5/02B28D7/00
Inventor 王金生李子法
Owner 王金生
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